Materials Map

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2014On the experimental Mixed-Mode failure of adhesively bonded metallic joints43citations

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Claudiu, Badulescu
1 / 1 shared
Nicolas, Carrere
1 / 2 shared
Y., Cognard J.
1 / 2 shared
Davies, Peter
1 / 131 shared
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2014

Co-Authors (by relevance)

  • Claudiu, Badulescu
  • Nicolas, Carrere
  • Y., Cognard J.
  • Davies, Peter
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article

On the experimental Mixed-Mode failure of adhesively bonded metallic joints

  • Georgios, Stamoulis
  • Claudiu, Badulescu
  • Nicolas, Carrere
  • Y., Cognard J.
  • Davies, Peter
Abstract

The use of adhesively bonded structures is widespread in various engineering fields, as they provide many advantages over other conventional types of mechanical joints. In this study, we use a crash optimized, single-component epoxy adhesive (SikaPower®-498 made of a rigid epoxy matrix containing soft, tough polymer inclusions that provide additional ductility to the adhesive layer) at a constant layer thickness of 0.5 mm to bond metallic substrates. We investigate its fracture properties under mode I and mixed-mode I/II loadings, in order to obtain the full fracture envelope. Mode I loading has been performed using the ISO 25217 standard: the substrates were designed according to the TDCB (Tapered Double Cantilever Beam) geometry, and the fracture toughness GIC has been calculated by means of the ECM (Experimental Compliance Method). Mixed-Mode I/II loading has been applied using the MMB (Mixed Mode Bending) experimental fixture described in the ASTM D6671 standard. The fracture toughness GC has been calculated via Finite Element Analysis and mode partitioning has been determined according to the methodology described in the standard. The mixed mode fracture behavior measured using the previous two methodologies shows that the adhesive seems to follow the Benzeggagh – Kenane failure criterion (expressed in 2D).

Topics
  • impedance spectroscopy
  • polymer
  • inclusion
  • fracture behavior
  • ductility
  • gas chromatography
  • finite element analysis
  • fracture toughness