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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Ghaleeh, Mohammad
University of Northampton
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2023Mathematical Modelling of Fused Deposition Modeling (FDM) 3D Printing of Poly Vinyl Alcohol Parts through Statistical Design of Experiments Approachcitations
- 2023Analytical and Numerical Investigation of Fatigue Life in Rectangular Plates with Opposite Semicircular Edge Single Notches
- 2020Microstructure, Isothermal and Thermomechanical Fatigue Behaviour of Leaded and Lead-free Solder Jointscitations
- 2020Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder jointscitations
- 2020Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder jointscitations
- 2015The durability of solder joints under thermo-mechanical loading; application to Sn-37Pb and Sn-3.8Ag-0.7Cu lead-free replacement alloy
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article
Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints
Abstract
The reliability of solder joints is a critical issue in the microelectronics industry. The requirement of permanent electrical and thermal connections between solder alloys and the various components of a surface mount device is dependent upon the mechanical integrity of the solder and its interfaces. Accordingly, in this paper, the reliability of lead-free, Sn-3.8Ag-0.7Cu, and leaded, Sn-37Pb, solder alloys was investigated under both thermal-mechanical fatigue (TMF) and isothermal mechanical fatigue (IF) conditions. The investigation included material characterisation and fatigue testing on 4-ball grid array (BGA) specimens. The IF tests were carried out under load control at three different temperatures including Room Temperature (RT), 35°C and 75°C. Also, a set of ‘not-in-phase’ (nIP), ‘in-phase’ (IP) and ‘out-of-phase’ (OoP) combined thermal and mechanical cycling tests were carried out to investigate the TMF behaviour of the solders. The stress-life curves for each test condition were generated and then compared taking into account the observations on microstructure. It was found that the IF and TMF performance of Sn-3.8Ag-0.7Cu alloy was better than Sn-37Pb alloy when expressed as stress-life curves. Additionally, the Sn-3.8Ag-0.7Cu was less susceptible to the changes in temperature. This study provides a comprehensive insight into the reliability of solder alloys under a wide range of loading conditions.