| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Gómez, Elvira
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2024Bismuth oxyiodide-based composites for advanced visible-light activation of peroxymonosulfate in pharmaceutical mineralizationcitations
- 2024Advanced degradation of organic pollutants using sonophotocatalytic peroxymonosulfate activation with CoFe2O4/Cu- and Ce-doped SnO2 compositescitations
- 2023Nanostructured Ir-based electrocatalysts for oxygen evolution prepared by galvanic displacement of Co and Nicitations
- 2020Electrodeposition of nanostructured cobalt films from a deep eutectic solvent: Influence of the substrate and deposition potential rangecitations
- 2020Efficient and green electrochemical synthesis of 4-aminophenol using porous Au micropillarscitations
- 2020Electrodeposition of nanostructured cobalt films from a deep eutectic solvent: influence of the substrate and deposition potential rangecitations
- 2018Surface sensitive nickel electrodeposition in deep eutectic solventcitations
- 2018Use of CO as a Cleaning Tool of Highly Active Surfaces in Contact with Ionic Liquids: Ni Deposition on Pt(111) Surfaces in ILcitations
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2014Conditions that bicontinuous microemulsions must fulfill to be used as template for electrodeposition of nanostructurescitations
- 2013Microemulsions for obtaining nanostructures by means of electrodeposition methodcitations
Places of action
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article
Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method
Abstract
A patterned anode tool was used to transfer electrodeposited microstructures on to an un-patterned A7 sized cathode by maintaining very narrow separation (300 µm) between the two electrodes and agitating the fluid in the inter-electrode gap by ultrasonic means. A non-acidic copper solution with a low content of metal ions and additives was used. Limiting current experiments were initially performed to demonstrate that improved and uniform agitation could be maintained within the inter-electrode gap at relatively low ultrasonic powers of 5to 30 W L-1. The best pattern definition was obtained at a US power of 5 W L-1 and a current density of 20 mA cm-2. Importantly, the results obtained were comparable to those obtained by conventional through-mask plating. A single anode tool could be used to pattern up to five substrates, substantially minimising the amount of lithographic processing required. These results suggest that the proposed technique is a useful mask-less microfabrication process for pattern transfer on to large substrates.