| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Green, Todd
University of Strathclyde
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloyscitations
- 2022Characteristics of anode materials for nickel electroformingcitations
- 2021Pulse electrodeposition of copper in the presence of a corrosion reactioncitations
- 2020Effect of water on the electrodeposition of copper from a deep eutectic solventcitations
- 2019Investigation of water absorption profile of mineral wool insulation
- 2018Anodic reactions and the corrosion of copper in deep eutectic solventscitations
- 2018Electrodeposition of Cu from a water-containing deep eutectic solvent
- 2017Pulse plating of copper from deep eutectic solventscitations
- 2017Electrodeposition of copper from deep eutectic solvents by using pulse current
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2012Pulse Plating
Places of action
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article
Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method
Abstract
A patterned anode tool was used to transfer electrodeposited microstructures on to an un-patterned A7 sized cathode by maintaining very narrow separation (300 µm) between the two electrodes and agitating the fluid in the inter-electrode gap by ultrasonic means. A non-acidic copper solution with a low content of metal ions and additives was used. Limiting current experiments were initially performed to demonstrate that improved and uniform agitation could be maintained within the inter-electrode gap at relatively low ultrasonic powers of 5to 30 W L-1. The best pattern definition was obtained at a US power of 5 W L-1 and a current density of 20 mA cm-2. Importantly, the results obtained were comparable to those obtained by conventional through-mask plating. A single anode tool could be used to pattern up to five substrates, substantially minimising the amount of lithographic processing required. These results suggest that the proposed technique is a useful mask-less microfabrication process for pattern transfer on to large substrates.