Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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977 Locations available

693.932 PEOPLE
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Naji, M.
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Cobley, Andrew

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Coventry University

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (38/38 displayed)

  • 2023Selective soldering nozzlescitations
  • 2023Analysis of Pre-Treatment Processes to Enable Electroplating on Nitrided Steelcitations
  • 2023The challenges in selective soldering and meeting training needscitations
  • 2021Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)7citations
  • 2020The effects of turmeric on the grain structure and properties of copper electrodeposited compositescitations
  • 2020MATUROLIFE: Using Advanced Material Science to Develop the Future of Assistive Technology3citations
  • 2018Ultrasound assisted electroless nickel-boron plating from alkaline borohydride bathcitations
  • 2018Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodeposition28citations
  • 2018Selective metallization of non-conductive materials by patterning of catalytic particles and the application of a gradient magnetic field1citations
  • 2018Additive process for patterned metallized conductive tracks on cotton with applications in smart textiles24citations
  • 2018Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field4citations
  • 2017Electroless deposition of nickel-boron coatings using low frequency ultrasonic agitation: Effect of ultrasonic frequency on the coatings.43citations
  • 2017Electroless deposition of nickel-boron coatings using low frequency ultrasonic agitation: Effect of ultrasonic frequency on the coatings properties and the deposition of electroless Ni-B composite.citations
  • 2016Properties of electroless Ni-B-WC composite coatingscitations
  • 2016Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatings51citations
  • 2016The Effect of Mixing and Degassing Conditions on the Properties of Epoxy/Anhydride Resin Systemcitations
  • 2016Bismuth-based composite coating for overlay applications in plain bearingscitations
  • 2015Ultrasound-assisted electrodeposition of thin Nickel-based composite coatings with lubricant particles67citations
  • 2015Effect of additive concentration during copper deposition using EnFACE electrolyte3citations
  • 2015Ultrasonic agitation in barrel electroplating: field trial results1citations
  • 2014Functionalised copper nanoparticles as catalysts for electroless plating7citations
  • 2014Ultrasound-assisted electrodeposition of composite coatings with particles116citations
  • 2013Ultrasonically enabled low temperature electroless plating for advanced electronic manufacturecitations
  • 2012Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture2citations
  • 2012Initial studies to optimise the sonochemical surface modification of a high Tg laminate2citations
  • 2012The use of ultrasound to enable low temperature electroless plating20citations
  • 2011Initial studies into the use of ultrasound to reduce process temperatures and chemical usage in the PCB desmear process6citations
  • 2010Eurointerfinish 20091citations
  • 2010Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles10citations
  • 2009Electroless methodscitations
  • 2008Improved Electroless Copper Compositioncitations
  • 2006Catalytic anodes for electrodeposition5citations
  • 2006Use of organic reductants to lower brightener consumption in acid copper electroplating bath utilising catalytic anodes5citations
  • 2004Method For Desmearing Resin Accretions And Texturing Resin Without Using Solventcitations
  • 2003Characterisation of insoluble anodes for acid copper electrodeposition11citations
  • 2003The effect of insoluble anodes on the process control and deposit quality of acid copper electroplating baths3citations
  • 2001Methods for achieving high speed acid copper electroplating in the PCB industry16citations
  • 2001The use of insoluble anodes in acid sulphate copper electrodeposition solutions15citations

Places of action

Chart of shared publication
Graves, John
13 / 16 shared
Monk, Nigel
1 / 3 shared
Mcmaster, Sj
3 / 13 shared
Chandrasekharan, Vishnu Kizhavallil
1 / 2 shared
Krümmling, Franz
1 / 1 shared
Bund, Andreas
2 / 23 shared
Groves, Eddie
1 / 1 shared
Witham, Kane
1 / 1 shared
Cave, Gwv
1 / 1 shared
Danilova, Sofya
2 / 2 shared
Pellicer, Eva
1 / 37 shared
Sort, Jordi
1 / 48 shared
Wu, Liang
2 / 10 shared
Merrill, R.
1 / 1 shared
Beddow, James
1 / 1 shared
Fuentes, E.
1 / 4 shared
Moody, Louise
1 / 6 shared
Vitry, Véronique
3 / 87 shared
Bains, Narinder
5 / 5 shared
Bonin, Luiza
3 / 20 shared
Danilova, S.
1 / 1 shared
Sort, J.
1 / 23 shared
Pellicer, E.
1 / 8 shared
Hunt, C.
1 / 2 shared
Ashayer-Soltani, R.
1 / 1 shared
Bush, J.
1 / 1 shared
Krzyzak, K.
1 / 1 shared
Wills, K. A.
1 / 1 shared
Bonin, L.
1 / 1 shared
Schmidt, Udo
1 / 5 shared
Tudela, Ignacio
1 / 2 shared
Camargo, Magali K.
1 / 2 shared
Krishnan, Latha
1 / 5 shared
Madan, Pal
1 / 1 shared
Yi, Zhang
1 / 1 shared
Kerr, Ian
2 / 2 shared
Ignacio, Tudela
1 / 1 shared
Zhang, Yi
1 / 17 shared
Tudela-Montes, Ignacio
1 / 1 shared
Pal, Madan
1 / 1 shared
Hussain, Azad
1 / 2 shared
Pena, E. M. Dela
1 / 1 shared
Roy, S.
1 / 19 shared
Hutt, D. A.
1 / 6 shared
Sugden, M.
1 / 1 shared
Litchfield, R. E.
1 / 1 shared
Pal, M.
1 / 10 shared
Tudela, I.
1 / 1 shared
Zhang, Y.
1 / 149 shared
Kerr, I.
1 / 1 shared
Kassim, A.
1 / 1 shared
Mkhlef, B.
2 / 2 shared
Abbas, B.
1 / 6 shared
Mkhlef, Bilal
1 / 1 shared
Abbas, B. M.
1 / 1 shared
Mason, Timothy J.
4 / 5 shared
Paniwnyk, Larysa
2 / 4 shared
Saez, Veronica
1 / 2 shared
Kellner, Rod
1 / 1 shared
Goosey, Martin
1 / 1 shared
Edgar, Lindsay
1 / 1 shared
Comeskey, D. J.
1 / 1 shared
Singh, Amrik
2 / 2 shared
Mark, A. Poole
3 / 3 shared
Bass, Kevin
1 / 1 shared
Deborah, V. Hirst
1 / 1 shared
Gabe, D. R.
6 / 6 shared
Martin, T. Goosey
1 / 1 shared
Chart of publication period
2023
2021
2020
2018
2017
2016
2015
2014
2013
2012
2011
2010
2009
2008
2006
2004
2003
2001

Co-Authors (by relevance)

  • Graves, John
  • Monk, Nigel
  • Mcmaster, Sj
  • Chandrasekharan, Vishnu Kizhavallil
  • Krümmling, Franz
  • Bund, Andreas
  • Groves, Eddie
  • Witham, Kane
  • Cave, Gwv
  • Danilova, Sofya
  • Pellicer, Eva
  • Sort, Jordi
  • Wu, Liang
  • Merrill, R.
  • Beddow, James
  • Fuentes, E.
  • Moody, Louise
  • Vitry, Véronique
  • Bains, Narinder
  • Bonin, Luiza
  • Danilova, S.
  • Sort, J.
  • Pellicer, E.
  • Hunt, C.
  • Ashayer-Soltani, R.
  • Bush, J.
  • Krzyzak, K.
  • Wills, K. A.
  • Bonin, L.
  • Schmidt, Udo
  • Tudela, Ignacio
  • Camargo, Magali K.
  • Krishnan, Latha
  • Madan, Pal
  • Yi, Zhang
  • Kerr, Ian
  • Ignacio, Tudela
  • Zhang, Yi
  • Tudela-Montes, Ignacio
  • Pal, Madan
  • Hussain, Azad
  • Pena, E. M. Dela
  • Roy, S.
  • Hutt, D. A.
  • Sugden, M.
  • Litchfield, R. E.
  • Pal, M.
  • Tudela, I.
  • Zhang, Y.
  • Kerr, I.
  • Kassim, A.
  • Mkhlef, B.
  • Abbas, B.
  • Mkhlef, Bilal
  • Abbas, B. M.
  • Mason, Timothy J.
  • Paniwnyk, Larysa
  • Saez, Veronica
  • Kellner, Rod
  • Goosey, Martin
  • Edgar, Lindsay
  • Comeskey, D. J.
  • Singh, Amrik
  • Mark, A. Poole
  • Bass, Kevin
  • Deborah, V. Hirst
  • Gabe, D. R.
  • Martin, T. Goosey
OrganizationsLocationPeople

article

Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatings

  • Schmidt, Udo
  • Tudela, Ignacio
  • Camargo, Magali K.
  • Cobley, Andrew
  • Bund, Andreas
Abstract

Pristine Zn and Zn-TiO2 coatings were galvanostatically electrodeposited on steel substrates from additive-free chloride-based plating baths under silent and ultrasonic conditions. An ultrasonic bath-setup (38 kHz) was used as a sonoelectrochemical system. The influence of ultrasonic irradiation on the layer properties was investigated using different combinations of ultrasonic power and current density. In general, the use of ultrasonic irradiation for assisting the electrodeposition of pristine Zn and Zn-TiO2 layers does have impact on the morphological and structural properties of the electrodeposits. The use of ultrasonic irradiation for dispersing particles during the electro-codeposition process was shown to be beneficial provided the use of suitable ultrasonic and deposition parameters. The incorporation of particles into the metallic matrix was confirmed with glow discharge optical emission spectroscopy investigations and focused-ion-beam-assisted cross-sectional analysis. The presence of TiO2 agglomerates having smaller sizes as well as a better distribution in the metallic matrix was observed for the combination of ultrasonic agitation and high-speed electrodeposition. Pyramidal textures corresponding to the (101), (102), (103) and (112) planes were found characteristic for Zn layers having incorporated TiO2 particles. One aspect of using ultrasonic agitation during electroplating is that Zn layers might also be prone to cavitation/erosion phenomena. Nevertheless, this effect can be controlled by adjusting the ultrasonic power as well as the ultrasonic irradiation time.<br/>

Topics
  • density
  • impedance spectroscopy
  • steel
  • texture
  • ultrasonic
  • current density
  • electrodeposition