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Malik, Safdar Abbas
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (3/3 displayed)
- 2019Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloycitations
- 2018Contacts and Interface Evolution in Thermoelectric Modules
- 2017Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatmentcitations
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article
Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatment
Abstract
The data presented in this article are related to the research article entitled: “Solder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodes” (Malik et al., 2017) [1]. This article presents microstructure obtained by scanning electron microscopy (SEM) and chemical analysis by energy dispersive X-ray spectroscopy (EDX) point measurements of the thermoelectric ZnSb legs after joining to metallic electrodes using solder (Zn-2Al) and free-soldering methods.