693.932 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Verdingovas, Vadimas
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2020Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloyscitations
- 2019Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loadscitations
- 2018Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activatorscitations
- 2018Corrosion Reliability of Lead-Free Solder Systems Used in Electronicscitations
- 2017Corrosion reliability of lead-free solder systems used in electronicscitations
- 2015Effect of iodine on the corrosion of Au-Al wire bondscitations
- 2014Corrosion in electronics: Overview of failures and countermeasures
- 2013Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics
Places of action
| Organizations | Location | People |
|---|
article
Effect of iodine on the corrosion of Au-Al wire bonds
Abstract
Corrosion study was performed on Au-Al wire bonds, thin layers of sputter deposited Au and Al, and Au-Al intermetallic nuggets. The test environment was iodine-vapour in air (1. mg/L) at 85 °C with varying relative humidity, and 500 mg/L of KI in water. GDOES, XRD, SEM EDS, wire bond shear, and electrochemical testing were used to characterize the samples. Failures of Au-Al wire bonds were found to be primarily attributed to the corrosion of Al via formation of Al iodides and consequent formation of Al oxides and/or hydroxides. Most susceptible to corrosion are Al metallization and Al rich intermetallic phases.