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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Daraio, C.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2016Highly nonlinear solitary waves in heterogeneous periodic granular mediacitations
- 2013Pressure-activated microsyringe composite scaffold of poly(L-lactic acid) and carbon nanotubes for bone tissue engineeringcitations
- 2011Highly nonlinear granular crystal sensor and actuator for delamination detection in composite structures
- 2011Modeling and in situ identification of material parameters for layered structures based on carbon nanotube arrayscitations
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article
Modeling and in situ identification of material parameters for layered structures based on carbon nanotube arrays
Abstract
We test and model the mechanical response of a multilayer composite structure composed of alternating layers of aligned carbon nanotubes and copper foils under compression. We employ a bistable mass-spring model to capture the three-phase hysteretic response of the loading curve with excellent agreement with the experimental observations. An in situ identification procedure is proposed to quantify the material parameters corresponding to the mesoscopic scale of the structure. We refine the results using a genetic algorithm and compare the response of two different models based on three and four springs in series. The localization of deformation can be accurately captured by these simplified models, which hold promise for the design of novel materials with tailored deformation responses. (C) 2011 Elsevier Ltd. All rights reserved.