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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Lanceros Mendez, S.
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Topics
Publications (9/9 displayed)
- 2018Piezoresistive polymer blends for electromechanical sensor applicationscitations
- 2015Effect of butadiene/styrene ratio, block structure and carbon nanotube content on the mechanical and electrical properties of thermoplastic elastomers after UV ageingcitations
- 2014Predicting the mechanical behavior of amorphous polymeric materials under strain through multi-scale simulationcitations
- 2014Extruded thermoplastic elastomers styrene-butadiene-styrene/carbon nanotubes composites for strain sensor applicationscitations
- 2012Determination of the parameters affecting electrospun chitosan fiber size distribution and morphologycitations
- 2010Enhancement of the Dielectric Constant and Thermal Properties of alpha-Poly(vinylidene fluoride)/Zeolite Nanocompositescitations
- 2009Piezoelectric micropump for lab-on-a-chip applicationscitations
- 2009Sigma-delta A/D converter for CMOS image sensorscitations
- 2004Dynamic mechanical analysis and creep behaviour of beta-PVDF filmscitations
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article
Piezoresistive polymer blends for electromechanical sensor applications
Abstract
Doped polyaniline (PANI) exhibits excellent electrical properties that can be used in composite materials to replace metallic or carbonaceous nanofillers commonly used in composites for sensor applications. Polymer blends based on PANI and thermoplastic elastomer styrene-ethylene/butylene-styrene (SEBS) copolymer have been prepared by solvent casting showing large strain yield (> 10% for 40 wt% PANI content), high electrical conductivity, 1 S/m, after the percolation threshold at approximate to 10 wt% PANI. Further, the composites show suitable piezoresistive response with gauge factor (GF) between GF approximate to 1.5 and 2.4 for deformations up to 10%. The overall properties of the solution casted PANI/SEBS blends indicate their suitability for advanced electromechanical sensors applications, with simple integration and processable by solution printing technologies.