• Faisal, Nadimul Haque
• Stukowski, Alexander
• Agrawal, Anupam
• Ratia, Vilma

Abstract

<p>During thermal spraying, hot particles impact on a colder substrate. This interaction of crystalline copper nanoparticles and copper substrate is modeled, using MD simulation. The quantitative results of the impacts at different velocities and temperatures are evaluated using a newly defined flattening aspect ratio. This ratio between the maximum diameter after the impact and the height of the splat increases with increasing Reynolds numbers until a critical value is reached. At higher Reynolds numbers the flattening aspect ratio decreases again, as the kinetic energy of the particle leads to increasing substrate temperature and, therefore, decreases the substrate resistance. Thus, the particle penetrates into the substrate and deforms less.</p>

Topics

• nanoparticle
• impedance spectroscopy
• simulation
• molecular dynamics
• laser emission spectroscopy
• copper