| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Ritucci, Ilaria
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2024Development of glass sealants for proton conducting ceramic cells:materials, concepts and challengescitations
- 2022Fracture toughness of reactive bonded Co–Mn and Cu–Mn contact layers after long-term agingcitations
- 2022Torsional behaviour of a glass-ceramic joined alumina coated Crofer 22 APU steelcitations
- 2022Torsional behaviour of a glass-ceramic joined alumina coated Crofer 22 APU steelcitations
- 2022Torsional behaviour of a glass-ceramic joined alumina coated Crofer 22 APU steelcitations
- 2021High toughness well conducting contact layers for solid oxide cell stacks by reactive oxidative bondingcitations
- 2019Improving the interface adherence in solid oxide cell stacks:Glass seals and oxygen electrode contact layers
- 2018A Ba-free sealing glass with a high CTE and excellent interface stability optimized for SOFC/SOEC stack applicationscitations
- 2018A Ba-free sealing glass with a high CTE and excellent interface stability optimized for SOFC/SOEC stack applicationscitations
- 2017A Novel SOFC/SOEC Sealing Glass with a Low SiO2 Content and a High Thermal Expansion Coefficient
- 2017A Novel SOFC/SOEC Sealing Glass with a Low SiO2 Content and a High Thermal Expansion Coefficientcitations
- 2017A Novel SOFC/SOEC Sealing Glass with a Low SiO 2 Content and a High Thermal Expansion Coefficientcitations
Places of action
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article
Fracture toughness of reactive bonded Co–Mn and Cu–Mn contact layers after long-term aging
Abstract
Creating a tough bond for the electrical contact between metallic interconnects and ceramic solid oxide cells (SOC) in a stack is challenging due to restrictions on the assembly temperature. The reactive oxidation bonding in the formation of Co<sub>2</sub>MnO<sub>4</sub> (CoMn) and Cu<sub>1.3</sub>Mn<sub>1.7</sub>O<sub>4</sub> (CuMn) spinel oxides from metallic precursors could provide a potential solution for achieving tough and well-conducting contact layers. These contact layers are deposited from metallic precursors onto CoCe-coated AISI441 substrates to achieve high toughness even after aging for 3000 h at typical operating temperatures for SOCs. The interface fracture energy of CoMn and CuMn contact layers was measured for as-sintered and aged samples by using a modified four-point bending test. After the fracture test, X-ray diffraction, electron microscopy, and energy-dispersive X-ray spectroscopy were used to determine phase evolution and possible reactions at the contact layer/interconnect interface. The results show that the interface fracture energy of sintered CoMn contact layer (6.1 J/m<sup>2</sup>) decreased to 2.9 J/m<sup>2</sup> after aging at 850 °C for 3000 h while the fracture energy for CuMn increased from 6.4 J/m<sup>2</sup> to 19.7 J/m<sup>2</sup>.