• Jarząbek, Dariusz
• Wojciechowski, Tomasz
• Chrzanowska, Justyna
• Dera, Wojciech
• Dziekoński, Cezary

Abstract

In this paper, the study of the mechanical properties of composites consisting of electrodeposited Ni and co-electrodeposited SiC particles coated with a thin Cu layer was presented. It was demonstrated that the coating allowed to increase the concentration of ceramic particles in the composite. Although the plating parameters were the same for both types of composites, the concentration of SiC was 15% for the composite containing coated particles (Ni/SiC-Cu) and 10% for the composite containing uncoated particles (Ni/SiC). Furthermore, tensile tests showed that the Ni/SiC-Cu samples exhibited higher Young's modulus than the pure electrodeposited Ni samples or Ni/SiC samples. The measured Young's modulus of the Ni/SiC-Cu composite was 250 ± 10 GPa. However, the ultimate tensile strength of the Ni/SiC-Cu composite was lower than that of pure Ni. To explain the mechanical behaviour of the Ni/SiC-Cu composite, the microstructure of the interface of this composite and its bonding strength were studied. Microstructure studies conducted using a scanning electron microscope (SEM) revealed that the SiC/Cu interface was smooth and of good quality whereas the Cu/Ni interface was rough but also of good quality. The measured bonding, normal, and shear strength values demonstrated that the SiC/Cu interface was weak, and that was the main reason for the low ultimate tensile strength of the composite. The shear strength of the SiC/Cu interface was measured using a novel method: micropillars shearing including atomic force microscopy (AFM). Finally, a simple finite element model of the Ni/SiC-Cu composite, based on cohesive elements, was developed.

Topics

• microstructure
• scanning electron microscopy
• atomic force microscopy
• strength
• composite
• tensile strength
• ceramic