Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2022New record high thermoelectric ZT of delafossite-based CuCrO<SUB>2</SUB> thin films obtained by simultaneously reducing electrical resistivity and thermal conductivity via heavy doping with controlled residual stress9citations

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Ohkubo, Isao
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Park, Sungkyun
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Baba, Takahiro
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Hong, Jongill
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Van Hoang, Dung
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2022

Co-Authors (by relevance)

  • Ohkubo, Isao
  • Park, Sungkyun
  • Bae, Jong-Seong
  • Baba, Takahiro
  • Hong, Jongill
  • Mori, Takao
  • Park, Hongjun
  • Tuan Thanh Pham, Anh
  • Bach Phan, Thang
  • Cao Tran, Vinh
  • Huu Nguyen, Truong
  • Van Hoang, Dung
  • Bao Nguyen Le, Thu
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article

New record high thermoelectric ZT of delafossite-based CuCrO<SUB>2</SUB> thin films obtained by simultaneously reducing electrical resistivity and thermal conductivity via heavy doping with controlled residual stress

  • Ohkubo, Isao
  • Park, Sungkyun
  • Bae, Jong-Seong
  • Baba, Takahiro
  • Dieu Thi Ung, Thuy
  • Hong, Jongill
  • Mori, Takao
  • Park, Hongjun
  • Tuan Thanh Pham, Anh
  • Bach Phan, Thang
  • Cao Tran, Vinh
  • Huu Nguyen, Truong
  • Van Hoang, Dung
  • Bao Nguyen Le, Thu
Abstract

Defect engineering can effectively modulate the band structure of a thermoelectric (TE) material, thereby enhancing its power factor S<SUP>2</SUP>σ. Furthermore, residual stress engineering influences the film performance, especially in the planar technologies. For the TE Mg-doped CuCrO<SUB>2</SUB>-based materials, the limitations in achieving an outstanding figure of merit, ZT, arise from their characteristically low charge carrier mobility and high thermal conductivity. Herein, we propose a combination of defect engineering and stress engineering via heavy doping CuCr<SUB>1-x</SUB>Mg<SUB>x</SUB>O<SUB>2</SUB> with × = 0.15 at different deposition temperatures to overcome the aforementioned limitations. Combining the compressive residual stress with multiscale defects (point defects, grain boundaries, and nano-inclusions) significantly reduces the thermal conductivity (κ) to 0.44 W/mK. The σ of the films shows a remarkable enhancement because of point defects introduced via heavy doping. Notably, the compressive-stressed films exhibit higher ZT values, compared to the tensile-stressed films. As a result, an outstanding approximated ZT of 0.66 is observed in the compressive-stressed CuCr<SUB>0.85</SUB>Mg<SUB>0.15</SUB>O<SUB>2</SUB> films, overcoming the limitations of its ZT value observed for the past two decades....

Topics
  • Deposition
  • impedance spectroscopy
  • grain
  • inclusion
  • resistivity
  • mobility
  • thin film
  • thermal conductivity
  • band structure
  • point defect