| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Zybała, Rafał
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2024Mg nanostructures with controlled dominant c-plane or m-plane facets by DC magnetron sputter depositioncitations
- 2024Using SPS Sintering System in Fabrication of Advanced Semiconductor Materials
- 2023Microstructural Evolution of Ni-SiC Composites Manufactured by Spark Plasma Sinteringcitations
- 2021Review of rapid fabrication methods of skutterudite materialscitations
- 2019Microstructure and thermoelectric properties of p and n type doped β-FeSi2 fabricated by mechanical alloying and pulse plasma sinteringcitations
- 2018Skutterudite (CoSb3) thermoelectric nanomaterials fabricated by Pulse Plasma in Liquidcitations
- 2017Effect of metallic coating on the properties of copper-silicon carbide compositescitations
- 2017Synthesis and characterization of antimony telluride for thermoelectric And optoelectronic applicationscitations
- 2017Microstructure and Thermal Properties of Cu-SiC Composite Materials Depending on the Sintering Techniquecitations
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article
Effect of metallic coating on the properties of copper-silicon carbide composites
Abstract
In the presented paper a coating of SiC particles with a metallic layer was used to prepare copper matrixcomposite materials. The role of the layer was to protect the silicon carbide from decomposition anddissolution of silicon in the copper matrix during the sintering process. The SiC particles were coveredby chromium, tungsten and titanium using Plasma Vapour Deposition method. After powder mixingof components, the final densification process via Spark Plasma Sintering (SPS) method at temperature950 ◦C was provided. The almost fully dense materials were obtained (>97.5%). The microstructure ofobtained composites was studied using scanning electron microscopy as well as transmission electronmicroscopy. The microstructural analysis of composites confirmed that regardless of the type of depositedmaterial, there is no evidence for decomposition process of silicon carbide in copper. In order to measurethe strength of the interface between ceramic particles and the metal matrix, the micro tensile testshave been performed. Furthermore, thermal diffusivity was measured with the use of the laser pulsetechnique. In the context of performed studies, the tungsten coating seems to be the most promisingsolution for heat sink application. Compared to pure composites without metallic layer, Cu-SiC with Wcoating indicate the higher tensile strength and thermal diffusitivy, irrespective of an amount of SiCreinforcement. The improvement of the composite properties is related to advantageous condition ofCu-SiC interface characterized by well homogenity and low porosity, as well as individual properties ofthe tungsten coating material.