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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Ratzker, Barak
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Publications (11/11 displayed)
- 2024MXene-CNC super performing composite films for flexible and degradable electronicscitations
- 2024The effect of coarse and fine Ti3SiC2 particle reinforcement in aluminum matrix compositescitations
- 2023MXene-Based Ceramic Nanocomposites Enabled by Pressure-Assisted Sinteringcitations
- 2023Exploring the capabilities of high-pressure spark plasma sintering (HPSPS)citations
- 2020Deformation in nanocrystalline ceramicscitations
- 2019Highly-doped Nd:YAG ceramics fabricated by conventional and high pressure SPScitations
- 2019Stress-enhanced dynamic grain growth during high-pressure spark plasma sintering of aluminacitations
- 2018Compression creep of copper under electric current studied by a spark plasma sintering (SPS) apparatuscitations
- 2018Transparent Polycrystalline Magnesium Aluminate Spinel Fabricated by Spark Plasma Sinteringcitations
- 2018High-pressure spark plasma sintering of silicon nitride with LiF additivecitations
- 2016Creep of polycrystalline magnesium aluminate spinel studied by an SPS apparatuscitations
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article
Stress-enhanced dynamic grain growth during high-pressure spark plasma sintering of alumina
Abstract
<p>Applying high pressure during the sintering of ceramic materials is a common practice that allows for a reduction of the sintering temperature and the obtaining of fine-grained microstructures. In this work, we show that the final grain size of submicron alumina increased consistently with applied pressure during low temperature (1000–1050 °C), high pressure (500–800 MPa) spark plasma sintering. Grain size trajectories and microstructural observations indicated that stress-enhanced grain growth occurred during the final stage of the sintering process, whereas thermally controlled grain boundary migration was negligible. We suggest that this dynamic, stress-enhanced grain growth is controlled by grain-boundary sliding, grain rotation and coalescence. A strong correlation was found between calculated creep strain rates and grain growth rates, such as during superplastic deformation.</p>