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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Taccardi, Nicola |
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Petrov, R. H. | Madrid |
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Casati, R. |
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Kočí, Jan | Prague |
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Azam, Siraj |
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Ospanova, Alyiya |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Wagner, Avital
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article
Stress-enhanced dynamic grain growth during high-pressure spark plasma sintering of alumina
Abstract
<p>Applying high pressure during the sintering of ceramic materials is a common practice that allows for a reduction of the sintering temperature and the obtaining of fine-grained microstructures. In this work, we show that the final grain size of submicron alumina increased consistently with applied pressure during low temperature (1000–1050 °C), high pressure (500–800 MPa) spark plasma sintering. Grain size trajectories and microstructural observations indicated that stress-enhanced grain growth occurred during the final stage of the sintering process, whereas thermally controlled grain boundary migration was negligible. We suggest that this dynamic, stress-enhanced grain growth is controlled by grain-boundary sliding, grain rotation and coalescence. A strong correlation was found between calculated creep strain rates and grain growth rates, such as during superplastic deformation.</p>