| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Li, Feng
Technical University of Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2023Effect of degree of substitution on the microphase separation and mechanical properties of cellooligosaccharide acetate-based elastomerscitations
- 2022Comparative study of tripropylamine and naphthylamine as additives in wave solder flux: investigation of solderability and corrosion effectscitations
- 2022Singlet and triplet to doublet energy transfer: improving organic light-emitting diodes with radicals
- 2022Amino acids as activators for wave solder flux systems: Investigation of solderability and humidity effectscitations
- 2022Singlet and triplet to doublet energy transfer: improving organic light-emitting diodes with radicals.
- 2021Alkanolamines as activators in no-clean flux systems: investigation of humidity robustness and solderabilitycitations
- 2020Humidity Robustness of Plasma-Coated PCBscitations
- 2020Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliabilitycitations
- 2020Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloyscitations
- 2018On the ductility of alpha titanium: The effect of temperature and deformation modecitations
- 2018On the ductility of alpha titanium: The effect of temperature and deformation modecitations
- 2018Corrosion Reliability of Lead-Free Solder Systems Used in Electronicscitations
- 2017Lubrication of aluminium versus diamond-like carbon contacts with hydrophobin proteinscitations
- 2017Corrosion reliability of lead-free solder systems used in electronicscitations
Places of action
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article
On the ductility of alpha titanium: The effect of temperature and deformation mode
Abstract
Single phase α-titanium shows anomalous warm deformation behaviour. As the temperature increases, ductility increases in uniaxial tension and decreases in biaxial stretching. Previously, this behaviour was attributed to an increase in strain rate sensitivity and a decrease in twinning activity with temperature. In this study, we show that it can instead be explained by an increase in slip anisotropy with temperature. Grade 2 CP-Ti sheet was tested in uniaxial tension at 20 °C and 300 °C to determine ductility, work hardening behaviour and the coefficient of plastic anisotropy (R-value). The increase in uniaxial ductility with temperature was found to be a consequence of an increasing rate of saturation work hardening with temperature. In the absence of significant twinning, this unexpected work hardening behaviour was attributed to an increase in slip anisotropy with temperature. This hypothesis was supported by crystal plasticity finite element modelling results, which are also able to predict the observed increase in surface roughness with temperature. The increase in anisotropy leads to higher strain localization which, coupled with the increasing work hardening rate helps explain why biaxial ductility decreases with increasing temperature. In addition to explaining the limitations in warm forming of Ti, understanding the origins of these effects contributes to our general understanding of the deformation of other hexagonal metals like Zr and Mg.