Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Hutt, D. A.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (6/6 displayed)

  • 2014Functionalised copper nanoparticles as catalysts for electroless plating7citations
  • 2008Integrated optical and electronic interconnect printed circuit board manufacturingcitations
  • 2006Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects199citations
  • 2002Electroless nickel bumping of aluminum bondpads - Part II: Electroless nickel plating23citations
  • 2000Investigation of a solder bumping technique for flip-chip interconnectioncitations
  • 2000Under bump metallisation of fine pitch flip-chip using electroless nickel deposition8citations

Places of action

Chart of shared publication
Cobley, Andrew
1 / 38 shared
Graves, John
1 / 16 shared
Sugden, M.
1 / 1 shared
Litchfield, R. E.
1 / 1 shared
Selviah, D. R.
1 / 1 shared
Bagshiahi, H.
1 / 1 shared
Milward, D.
1 / 1 shared
Conway, P. P.
4 / 6 shared
Zakariyah, S. S.
1 / 1 shared
Suyal, H.
1 / 3 shared
Papakonstantinou, I.
1 / 10 shared
Wang, K.
1 / 27 shared
Walker, A. C.
1 / 2 shared
Chappell, J.
1 / 1 shared
Mccarthy, A.
1 / 6 shared
Fernández, F. A.
1 / 1 shared
Clode, M. P.
1 / 9 shared
Mannan, Samjid Hassan
4 / 29 shared
Whalley, D. C.
4 / 13 shared
Li, J. F.
1 / 5 shared
Liu, C. Q.
1 / 1 shared
Rhodes, D. G.
1 / 1 shared
Holmes, A. S.
1 / 2 shared
Liu, C.
1 / 47 shared
Chart of publication period
2014
2008
2006
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Co-Authors (by relevance)

  • Cobley, Andrew
  • Graves, John
  • Sugden, M.
  • Litchfield, R. E.
  • Selviah, D. R.
  • Bagshiahi, H.
  • Milward, D.
  • Conway, P. P.
  • Zakariyah, S. S.
  • Suyal, H.
  • Papakonstantinou, I.
  • Wang, K.
  • Walker, A. C.
  • Chappell, J.
  • Mccarthy, A.
  • Fernández, F. A.
  • Clode, M. P.
  • Mannan, Samjid Hassan
  • Whalley, D. C.
  • Li, J. F.
  • Liu, C. Q.
  • Rhodes, D. G.
  • Holmes, A. S.
  • Liu, C.
OrganizationsLocationPeople

article

Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects

  • Clode, M. P.
  • Hutt, D. A.
  • Mannan, Samjid Hassan
  • Whalley, D. C.
  • Li, J. F.
Abstract

This paper reports on the interfacial reaction kinetics between molten Sn-58Bi solder and Cu substrates for extended temporal scales. Also studied are the effects of a series of elemental additions of 1-2 wt.% Al, Cr, Cu, Si, Zn, Ag, An, Pt and Nb into the basic Sn-5813i solder, in an attempt to produce a barrier layer that slows down intermetallic compound (IMC) growth. At temperatures between 200 and 240 degrees C, grain boundary-/molten channel-controlled growth of eta-phase (Cu6Sn5), followed by diffusion-controlled simultaneous growth of the epsilon-phase (Cu3Sn) and eta-phase (Cu6Sn5), between the molten Sn-5813i solder and the Cu substrate was observed, and a layer of 6 mu m Cu could survive for approximately 24-48 h. Addition of 1 wt.% Zn resulted in a layer of gamma-Cu5Zn8, instead of Cu3Sn and Cu6Sn5, forming at the interface, leading to an increase in the lifetime of the Cu substrate to greater than 120 h at 200 degrees C, while the other additions failed to slow down IMC formation. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved

Topics
  • compound
  • grain
  • phase
  • grain boundary
  • forming
  • intermetallic