• Strusevich, Nadezhda
• Patel, Mayur
• Desmulliez, Marc P. Y.
• Abraham, Eitan
• Flynn, David
• Jones, Thomas

Abstract

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acousticstreaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

Topics

• experiment
• copper
• electrodeposition