| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Lee, Young-Joo
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (1/1 displayed)
Places of action
| Organizations | Location | People |
|---|
article
Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer
Abstract
The mechanical fatigue of Cu films and lines on flexible substrates was investigated,and an improvement in the structures through the use of a MoTi alloy under-layerwas proposed. Fatigue reliability was decreased by 3-fold in lines compared withfilms in the tensile condition and by 6-fold in the compressive condition. Crackformation was observed to be more detrimental for lines than for films. With a MoTiunder-layer, the fatigue limit was increased by 2 times that of a structure withoutMoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improvedthe fatigue reliability under compressive bending.