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Santra, Sangeeta
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article
Phase evolution in the AuCu/Sn system by solid-state reactive diffusion
Abstract
<p>The interfacial reactions between several Au(Cu) alloys and pure Sn were studied experimentally at 200°C. Amounts of Cu in the AuSn<sub>4</sub> and AuSn<sub>2</sub> phases were as low as 1 at.%. On the basis of these experimental results there is no continuous solid solution between (Au,Cu)Sn and (Cu,Au)<sub>6</sub>Sn<sub>5</sub>. The copper content of (Au,Cu)Sn was determined to be approximately 7-8 at.%. Substantial amounts of Au were present in the (Cu,Au)<sub>6</sub>Sn<sub>5</sub> and (Cu,Au)<sub>3</sub>Sn phases. Two ternary compounds were formed, one with stoichiometry varying from (Au <sub>40.5</sub>Cu<sub>39</sub>)Sn<sub>20.5</sub> to (Au<sub>20.2</sub>Cu <sub>59.3</sub>)Sn<sub>20.5</sub> (ternary "B"), the other with the composition Au<sub>34</sub>Cu<sub>33</sub>Sn<sub>33</sub> (ternary "C"). The measured phase boundary compositions of the product phases are plotted on the available Au-Cu-Sn isotherm and the phase equilibria are discussed. The complexity and average thickness of the diffusion zone decreases with increasing Cu content except for the Au(40 at.%Cu) couple. © 2014 TMS.</p>