Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (3/3 displayed)

  • 2022Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics5citations
  • 2021Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics5citations
  • 2021Assessment of the stepped isothermal method for accelerated creep testing of high-density polyethylene9citations

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Chart of shared publication
Gschwandl, Mario
2 / 2 shared
Schipfer, Christian
2 / 2 shared
Fuchs, Peter
2 / 7 shared
Schingale, Angelika
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Antretter, Thomas
2 / 37 shared
Feuchter, Michael
2 / 14 shared
Tao, Qi
2 / 3 shared
Pinter, Gerald
1 / 67 shared
Wurzer, Stefan
1 / 1 shared
Pilz, Gerald
1 / 2 shared
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2022
2021

Co-Authors (by relevance)

  • Gschwandl, Mario
  • Schipfer, Christian
  • Fuchs, Peter
  • Schingale, Angelika
  • Antretter, Thomas
  • Feuchter, Michael
  • Tao, Qi
  • Pinter, Gerald
  • Wurzer, Stefan
  • Pilz, Gerald
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article

Assessment of the stepped isothermal method for accelerated creep testing of high-density polyethylene

  • Pinter, Gerald
  • Morak, Matthias
  • Wurzer, Stefan
  • Pilz, Gerald
Abstract

<p>Thermoplastic materials are increasingly used in demanding structural applications under, in some cases, long-term static loading over several decades. In this regard, the stepped isothermal method (SIM) with creep testing at stepwise increased temperature levels in combination with time-temperature superposition (TTSP) provides a very time efficient procedure for long-term creep characterization. In the present study, the creep behavior of an injection molded high-density polyethylene material (HDPE) was investigated by SIM in the thermally untreated state as well as after annealing. Due to experimental issues regarding the heating behavior of the specimens and non-linear viscoelastic behavior, particularly at elevated temperatures, bi-directional curve shifting was required in order to generate meaningful master curves for creep compliance. In a first step, an Arrhenius equation was used for the horizontal curve shifting, based on activation energies, determined in additional multi-frequency dynamic mechanical analysis (DMA). Continuous master curves were then obtained by empirical vertical shifting of the individual creep curve segments for the different temperature levels. In general, good agreement was observed between the resulting SIM master curves and the corresponding conventionally measured creep compliance curves at least for a time range up to 300 hours. Furthermore, significant differences in the creep tendency of the annealed material state compared to the thermally untreated condition revealed the distinct influence of the thermal history on the resulting creep behavior.</p>

Topics
  • density
  • annealing
  • activation
  • thermoplastic
  • creep
  • selective ion monitoring
  • dynamic mechanical analysis