Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (2/2 displayed)

  • 2021Additive manufacturing of electronics from silver nanopowders sintered on 3D printed low-temperature substrates13citations
  • 2019Heterophase materials for fused filament fabrication of structural electronics33citations

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Słoma, Marcin
2 / 21 shared
Podsiadły, Bartłomiej
1 / 8 shared
Skalski, Andrzej
1 / 13 shared
Chart of publication period
2021
2019

Co-Authors (by relevance)

  • Słoma, Marcin
  • Podsiadły, Bartłomiej
  • Skalski, Andrzej
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article

Heterophase materials for fused filament fabrication of structural electronics

  • Podsiadły, Bartłomiej
  • Słoma, Marcin
  • Wałpuski, Bartłomiej
  • Skalski, Andrzej
Abstract

In this work, new electrically conductive composite filaments are developed for the fabrication of conductive paths, 3D printed with FDM technology. These composite materials consist of electrically conductive copper powder and a polymer matrix. The influence of three different polymers (ABS, PLA, PS) on the electrical properties of the composites was examined. Electrical measurements of the composite filaments with the increasing copper powder concentrations, allow identifying the percolation threshold for elaborated composites. Results show that the lowest resistivity (0.156×10−5 Ωm) was achieved for the ABS/Cu composite at the 84.6 wt% Cu concentration. The obtained resistivity values are much lower than for otherconductive composites and nanocomposites filaments reported in the literature. Voltage-current characteristics determined for each composite material showed that composites have Ohmic characteristics in low voltage regime. At high voltage regime, the electrical power dissipated in the composites caused a rapid increase in temperature. It was discovered that a polymer matrix influences the maximum value of the electrical power that can be dissipated in the filament before losing electrical conductivity. Examples of conductive 3D printed structures made from elaborated composites are also presented.

Topics
  • nanocomposite
  • polymer
  • resistivity
  • copper
  • electrical conductivity
  • copper powder