| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Teixeira, S.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2021NUMERICAL SIMULATION OF SOLDER PASTE PRINTING ON THROUGH-HOLE COMPONENTS
- 2021Experimental measurements of the shear force on surface mount components simulating the wave soldering processcitations
- 2020Influence of Operating Conditions on the Thermal Behavior and Kinetics of Pine Wood Particles Using Thermogravimetric Analysiscitations
- 2018Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substratescitations
- 2017Photocatalytic degradation of recalcitrant micropollutants by reusable Fe<inf>3</inf>O<inf>4</inf>/SiO<inf>2</inf>/TiO<inf>2</inf> particlescitations
- 2016Influence of Copper Layer Content in the Elastic and Damping Behavior of Glass-Fiber/Epoxy-Resin Compositescitations
- 2016TiO<inf>2</inf>/graphene oxide immobilized in P(VDF-TrFE) electrospun membranes with enhanced visible-light-induced photocatalytic performancecitations
- 2016Reusability of photocatalytic TiO <inf>2</inf> and ZnO nanoparticles immobilized in poly(vinylidene difluoride)-co-trifluoroethylenecitations
- 2016Ciprofloxacin wastewater treated by UVA photocatalysis: Contribution of irradiated TiO<inf>2</inf> and ZnO nanoparticles on the final toxicity as assessed by Vibrio fischericitations
- 2015Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospherecitations
- 2010In vivo evaluation of highly macroporous ceramic scaffolds for bone tissue engineeringcitations
- 2004Production of porus hydroxyapatite with potential for controlled drug delivery
- 2004Porous hydroxyapatite and glass reinforced hydroxyapatite for controlled release of sodium ampicillin
Places of action
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article
Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere
Abstract
The wettability between solder and substrate is a very important issue in reliability of soldering process. The contact angle theta is used to measure the degree of wetting. The contact angle of lead-free alloy Sn-3 % Ag-0.5 % Cu (wt%) was measured, as a function of temperature, for three different commercial surface finish substrates used in printed circuit boards (PCB): Sn, NiAu and Organic Solderability Preservative (OSP). The measurements were performed by the sessile drop method in two different atmospheres: high vacuum and inert gas. In high vacuum the results showed that on substrates of NiAu and OSP the solder started spreading suddenly at 225 degrees C and in Sn substrate the contact angle decreases slightly with temperature. In inert gas atmosphere the results showed different behaviours: the contact angle between molten solder in OSP and NiAu substrates is sensitive to temperature; and, in Sn substrate, the contact angle does not change with temperature. The NiAu and OSP substrates showed a better degree of wettability than Sn substrate, in inert atmosphere.