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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Petrov, R. H. | Madrid |
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Casati, R. |
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Kočí, Jan | Prague |
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Azam, Siraj |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Liebau, Maik
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article
Contact improvement of carbon nanotubes via electroless nickel deposition
Abstract
Individual multi-walled carbon nanotubes (CNTs) were deposited onto microelectrodes and embedded in nickel to achieve low-ohmic contact resistances. Electroless deposition of nickel onto gold/iron, palladium, and cobalt microelectrodes was used to form electrically stable bonds at the interfaces between the electrodes and CNTs. Resistance measurements showed that the contact resistances of the CNTs on gold/iron and palladium were significantly improved by nickel embedding, whereas no further improvement was found for the CNTs on cobalt. Electroless metal deposition is a parallel process providing stable electrical and mechanical contacts between CNTs and metallic microelectrodes.