• Hloch, Sergej
• Dwivedi, Suryank
• Srivastava, Ashish Kumar
• Dixit, Amit Rai
• Nag, Akash

Abstract

<jats:title>Abstract </jats:title><jats:p>Lightweight composite materials for potential thermal applications are the contemporary demand for manufacturing and aircraft industries where the possibility to improve and tailor the desired properties is based on the application. Carbonized eggshell powder is a solid lubricant with absorbent capability and has proven as a reinforcement for metallic base composites. In the present work, an attempt is made to investigate the effect of carbonized chicken eggshell powder (3 to 9% by weight) on the microstructural and thermal properties of Al7075 alloy processed by solid-state friction stir processing. An infrared thermography and three K-type thermocouples equipped with the base plate at three equal distances are used to measure the temperature with respect to time. The comparative study of microstructure and grain structure analysis has been done by light microscopy, scanning electron microscopy, and electron backscattered diffraction methods. The findings explored the dynamic recrystallization and grain recovery with a reduced grain size of 6.2 to 10.3 µm at a varying percentage of eggshell powder (3 to 9%) in the stir zone. The thermal conductivity and coefficient of thermal expansion (CTE) were measured for the temperature range of 50 to 400 °C. In addition to it, differential thermal analysis (DTA), thermo-gravimetric analysis (TGA), and derivative thermo-gravimetric analysis (DTG) are conducted for the temperature range of 25 to 900 °C to discuss the endothermic, exothermic nature, and degradation characteristics. The result revealed the decreasing trend of thermal conductivity, and CTE values were found in the range of 97 to 53 W/mK and 26.6 to 24 × 10<jats:sup>−6</jats:sup> K<jats:sup>−1</jats:sup> (heating cycle), 27.2 to 23.8 × 10<jats:sup>−6</jats:sup> K<jats:sup>−1</jats:sup>(cooling cycle), respectively. Furthermore, the higher and lower thermal conductivity of 108 W/mK and 62 W/mK is observed at higher and lower terminal voltages, 250 V and 100 V, respectively. The DTA, TGA, and DTG curves explored the maximum weight loss, which varies up to 5.25% with exothermic peaks and decomposition steps for each surface composite.</jats:p>

Topics

• impedance spectroscopy
• surface
• grain
• grain size
• scanning electron microscopy
• composite
• thermogravimetry
• thermal expansion
• recrystallization
• thermal conductivity
• decomposition
• differential thermal analysis
• gravimetric analysis
• thermography
• diffraction method