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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Muñoz-Rojas, David
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2024Enhanced Dielectric Properties of Recycled PLA/BaTiO$_3$ Nanocomposites: Towards Sustainable Capacitor Applications
- 2024Exploring the degradation of silver nanowire networks under thermal stress by coupling in situ X-ray diffraction and electrical resistance measurementscitations
- 2024Silver nanowire networks coated with a few nanometer thick aluminum nitride films for ultra-transparent and robust heating applicationscitations
- 2024Towards enhanced transparent conductive nanocomposites based on metallic nanowire networks coated with metal oxides: a brief reviewcitations
- 2024Sustainable Composite Materials: High Dielectric Performance of Recycled Polylactic Acid/La1.5Sr0.5NiO4 for Future Energy Storage Systems
- 2023Comparative Study of the Environmental Impact of Depositing Al 2 O 3 by Atomic Layer Deposition and Spatial Atomic Layer Depositioncitations
- 2023Tuning the texture and polarity of ZnO thin films deposited by spatial atomic layer deposition through the addition of a volatile shape-directing agentcitations
- 2022Atmospheric atomic layer deposition of SnO 2 thin films with Tin(II) acetylacetonate and watercitations
- 2022Advances in Flexible Metallic Transparent Electrodescitations
- 2022Stable Flexible Transparent Electrodes for Localized Heating of Lab‐on‐a‐Chip Devicescitations
- 2021Liquid atomic layer deposition as emergent technology for the fabrication of thin filmscitations
- 2021Open-air printing of Cu2O thin films with high hole mobility for semitransparent solar harvesterscitations
- 2021Open-air printing of Cu2O thin films with high hole mobility for semitransparent solar harvesterscitations
- 2021Tuning the band gap and carrier concentration of titania films grown by spatial atomic layer deposition: a precursor comparison.
- 2018Visualization of nanocrystalline CuO in the grain boundaries of Cu2O thin films and effect on band bending and film resistivitycitations
- 2018electron tunneling through grain boundaries in transparent conductive oxides and implications for electrical conductivity the case of zno al thin filmscitations
- 2017High quality epitaxial fluorine-doped SnO2 films by ultrasonic spray pyrolysis: Structural and physical property investigationcitations
- 2015Influence of an Inorganic Interlayer on Exciton Separation in Hybrid Solar Cells.
Places of action
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article
Advances in Flexible Metallic Transparent Electrodes
Abstract
Transparent electrodes (TEs) are pivotal components in many modern devices such as solar cells, light-emitting diodes, touch screens, wearable electronic devices, smart windows, or transparent heaters. Recently, the high demand for flexibility and low cost in TEs requires a new class of transparent conductive materials (TCMs) as substitutes for conventional indium tin oxide (ITO), which is so far the most used TCM but exhibits brittleness and high cost. Among the different emerging alternative materials to ITO, metallic nanomaterials have received much interest due to their remarkable optical-electrical properties, low cost, ease of manufacturing, flexibility, and widespread applicability. These involve metal grids, thin oxide/metal/oxide multilayers, metal nanowire percolating networks, or nanocomposites based on metallic nanostructures. In this review, a comparison between TCMs based on metallic nanomaterials and other TCM technologies is discussed. Next, the different types of metalbased TCMs developed so far and the fabrication technologies used are presented. Then, the challenges that these TCMs face towards integration in functional devices are discussed. Finally, the various fields in which metal-based TCMs have been successfully applied as well as emerging and potential applications are summarized.