Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2022Hierarchically Interlaced 2D Copper Iodide/MXene Composite for High Thermoelectric Performance21citations

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Karthikeyan, Vaithinathan
1 / 17 shared
Vellaisamy, Arul Lenus Roy
1 / 18 shared
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2022

Co-Authors (by relevance)

  • Karthikeyan, Vaithinathan
  • Vellaisamy, Arul Lenus Roy
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article

Hierarchically Interlaced 2D Copper Iodide/MXene Composite for High Thermoelectric Performance

  • Karthikeyan, Vaithinathan
  • Vellaisamy, Arul Lenus Roy
  • Souza, Maria Merlyne De
Abstract

Hierarchical layered architecture in thermoelectric materials works as an ad hoc methodology for strengthening the unique inherent properties. Here, we demonstrate an excellent thermoelectric behavior in novel 2D copper iodide nanoflakes by compositing with Ti<sub>3</sub>C<sub>2 </sub>MXene nanoinclusions. The interlaced architecture of CuI/Ti<sub>3</sub>C<sub>2</sub> composite lifts the electrical conductivity over two orders by efficient charge transport mechanisms. The thermal conductivity of CuI/Ti<sub>3</sub>C<sub>2</sub> composite are reduced by drastic suppression of mid-and high-frequency phonons by interfacial energy barrier scattering. Our structural engineering approach yields a massive power factor of 225 µW m<sup>-1</sup> K<sup>-2</sup> and a figure of merit value of 0.48 in CuI/5 vol.% Ti<sub>3</sub>C<sub>2</sub> composite. We establish a straightforward approach of tuning the figure of merit in earth-abundant, non-toxic thermoelectric materials to develop future sustainable energy sources.

Topics
  • layered
  • composite
  • copper
  • interfacial
  • thermal conductivity
  • electrical conductivity
  • interfacial energy