Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (2/2 displayed)

  • 2021Surface Preconditioning and Postmetallization Anneal Improving Interface Properties and Vth Stability under Positive Gate Bias Stress in AlGaN/GaN MIS-HEMTs13citations
  • 2007Basic Concepts and Interfacial Aspects of High-Efficiency III-V Multijunction Solar Cells27citations

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Großer, Andreas
1 / 1 shared
Mikolajick, Thomas
1 / 92 shared
Calzolaro, Anthony
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Gärtner, Jan
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Wachowiak, Andre
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Schwarzburg, Klaus
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Sağol, B. Erol
1 / 1 shared
Hannappel, Thomas
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Seidel, Ulf
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2021
2007

Co-Authors (by relevance)

  • Großer, Andreas
  • Mikolajick, Thomas
  • Calzolaro, Anthony
  • Gärtner, Jan
  • Wachowiak, Andre
  • Schwarzburg, Klaus
  • Sağol, B. Erol
  • Hannappel, Thomas
  • Seidel, Ulf
OrganizationsLocationPeople

article

Surface Preconditioning and Postmetallization Anneal Improving Interface Properties and Vth Stability under Positive Gate Bias Stress in AlGaN/GaN MIS-HEMTs

  • Großer, Andreas
  • Mikolajick, Thomas
  • Calzolaro, Anthony
  • Szabó, Nadine
  • Gärtner, Jan
  • Wachowiak, Andre
Abstract

<p>Trap states at the dielectric/GaN interface of AlGaN/GaN-based metal–insulator–semiconductor high electron mobility transistors (MIS-HEMTs) can cause threshold voltage (V<sub>th</sub>) instability especially under positive gate bias stress. Herein, the influence of O<sub>2</sub> plasma surface preconditioning (SPC) before the atomic layer deposition of the Al<sub>2</sub>O<sub>3</sub> gate dielectric and of N<sub>2</sub> postmetallization anneal (PMA) after gate metallization on the Al<sub>2</sub>O<sub>3</sub>/GaN interface quality is investigated. The interface is characterized by multifrequency capacitance–voltage measurements which show a smaller frequency dispersion after the employment of SPC and PMA treatments with a reduction of the interface trap density D<sub>it</sub> to a value in the order of 2 × 10<sup>12</sup> cm<sup>−2</sup> eV<sup>−1</sup> near the conduction band edge. The effectiveness of SPC and PMA is demonstrated in Al<sub>2</sub>O<sub>3</sub>/AlGaN/GaN MIS-HEMTs by pulsed current–voltage measurements which reveal improved V<sub>th</sub> stability.</p>

Topics
  • density
  • impedance spectroscopy
  • dispersion
  • surface
  • mobility
  • semiconductor
  • atomic layer deposition