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Naji, M. |
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Motta, Antonella |
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Ali, M. A. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Szabó, Nadine
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article
Surface Preconditioning and Postmetallization Anneal Improving Interface Properties and Vth Stability under Positive Gate Bias Stress in AlGaN/GaN MIS-HEMTs
Abstract
<p>Trap states at the dielectric/GaN interface of AlGaN/GaN-based metal–insulator–semiconductor high electron mobility transistors (MIS-HEMTs) can cause threshold voltage (V<sub>th</sub>) instability especially under positive gate bias stress. Herein, the influence of O<sub>2</sub> plasma surface preconditioning (SPC) before the atomic layer deposition of the Al<sub>2</sub>O<sub>3</sub> gate dielectric and of N<sub>2</sub> postmetallization anneal (PMA) after gate metallization on the Al<sub>2</sub>O<sub>3</sub>/GaN interface quality is investigated. The interface is characterized by multifrequency capacitance–voltage measurements which show a smaller frequency dispersion after the employment of SPC and PMA treatments with a reduction of the interface trap density D<sub>it</sub> to a value in the order of 2 × 10<sup>12</sup> cm<sup>−2</sup> eV<sup>−1</sup> near the conduction band edge. The effectiveness of SPC and PMA is demonstrated in Al<sub>2</sub>O<sub>3</sub>/AlGaN/GaN MIS-HEMTs by pulsed current–voltage measurements which reveal improved V<sub>th</sub> stability.</p>