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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Petrov, R. H. | Madrid |
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| Casati, R. |
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| Kočí, Jan | Prague |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Ali, M. A. |
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| Rančić, M. |
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| Azevedo, Nuno Monteiro |
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Ingram, S. E.
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Topics
Publications (3/3 displayed)
- 2008Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite systemcitations
- 2007Properties of epoxy nanoclay system based on diaminodiphenyl sulfone and diglycidyl ether of bisphenol f: influence of post cure and structure of amine and epoxycitations
- 2007Some factors influencing exfoliation and physical property enhancement in nanoclay epoxy resins based on diglycidyl ethers of bisphenol A and Fcitations
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article
Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system
Abstract
BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure.RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected.CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry(Taken from Wiley InterScience web site: http://www3.interscience.wiley.com/journal/121409993/abstract)