Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (7/7 displayed)

  • 2020Thermal Characterization and Improvement of Curing Stage in Resin Transfer Molding Process2citations
  • 2018An Optimized Control Volume/Finite Element Method (CV/FEM) for Non-Isothermal Liquid Composite Molding (LCM) Process3citations
  • 2014The identification of effective thermal conductivity for fibrous reinforcement composite by inverse method4citations
  • 2014The identification of effective thermal conductivity for fibrous reinforcement composite by inverse method4citations
  • 2012Numerical simulation of thickness variation effect on resin transfer molding process4citations
  • 2012Optimization of the cycle time in resin transfer molding process by numerical simulation23citations
  • 2011A fast computational model to the simulation of non‐isothermal mold filling process in resin transfer molding9citations

Places of action

Chart of shared publication
Elyoussfi, Soukaina
1 / 1 shared
Echchelh, Adil
6 / 7 shared
Hattabi, Mohamed
5 / 5 shared
Hattabi, M.
2 / 4 shared
Ganaoui, M. El
2 / 2 shared
Ganaoui, Mohammed El
3 / 4 shared
El Ganaoui, Mohammed
1 / 12 shared
Echchelh, A.
1 / 3 shared
Chart of publication period
2020
2018
2014
2012
2011

Co-Authors (by relevance)

  • Elyoussfi, Soukaina
  • Echchelh, Adil
  • Hattabi, Mohamed
  • Hattabi, M.
  • Ganaoui, M. El
  • Ganaoui, Mohammed El
  • El Ganaoui, Mohammed
  • Echchelh, A.
OrganizationsLocationPeople

article

A fast computational model to the simulation of non‐isothermal mold filling process in resin transfer molding

  • Echchelh, Adil
  • Hattabi, Mohamed
  • Saad, Aouatif
  • Ganaoui, Mohammed El
Abstract

<jats:title>Abstract</jats:title><jats:p>The numerical simulation of mass and heat transfer model for the curing stage of the resin transfer molding (RTM) process is known as a useful method to analyze the process before the mold is actually built. Despite the intense interest in the modeling and simulation of this process, the relevant work is currently limited to development of flow models during filling stage. Optimization of non‐isothermal mold filling simulation time without losing the efficiency remains an important challenge in RTM process. These were some reasons that motivate our work; namely the interested on the amelioration of the performance of RTM simulation code in term of execution time and memory space occupation. Our approach is accomplished in two steps; first by the modification of the control volume/ finite element method (CV/FEM) and second by the implementation in the modified code of an adapted conjugate gradient algorithm to the compressed sparse row storage scheme. The validity of our approach is evaluated with analytical results and excellent agreement was found. The results show that our optimization strategy leads to maximum reduction in time and space memory. This allows one to deal with problems with great and complex dimensions mostly encountered in RTM application field, without interesting in the constraint of space or time. POLYM. COMPOS., 2011. © 2011 Society of Plastics Engineers</jats:p>

Topics
  • impedance spectroscopy
  • polymer
  • simulation
  • resin
  • curing