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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Fletcher, Philip J.
University of Bath
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2024Molecularly rigid porous polyamine host enhances barium titanate catalysed H 2 O 2 generation †
- 2024Molecularly Rigid Porous Polyamine Host Enhances Barium Titanate Catalysed H2O2 Generation
- 2021Defect-Engineered β-MnO2-δ Precursors Control the Structure-Property Relationships in High-Voltage Spinel LiMn1.5Ni0.5O4-δcitations
- 2021Ionic Diode and Molecular Pump Phenomena Associated with Caffeic Acid Accumulated into an Intrinsically Microporous Polyamine (PIM-EA-TB)citations
- 2020Indirect (Hydrogen-Driven) Electrodeposition of Porous Silver onto a Palladium Membranecitations
- 2020Effects of dissolved gases on partial anodic passivation phenomena at copper microelectrodes immersed in aqueous NaClcitations
- 2020Linking the Cu(II/I) and the Ni(IV/II) Potentials to Subsequent Passive Film Breakdown for a Cu-Ni Alloy in Aqueous 0.5 M NaClcitations
- 2019Effects of Dissolved Gases on Partial Anodic Passivation Phenomena at Copper Microelectrodes Immersed in Aqueous NaCl
- 2019Polymer of Intrinsic Microporosity (PIM-7) Coating Affects Triphasic Palladium Electrocatalysiscitations
- 2018Polymer of Intrinsic Microporosity (PIM-7) Coating Affects Triphasic Palladium Electrocatalysiscitations
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article
Linking the Cu(II/I) and the Ni(IV/II) Potentials to Subsequent Passive Film Breakdown for a Cu-Ni Alloy in Aqueous 0.5 M NaCl
Abstract
Copper and copper-nickel alloys are known to form partially passive films in marine conditions, both naturally and under positive potential bias. Here, the anodic passivation behaviour of copper and of constantan (Cu54Ni45Mn1) as a model for a copper-nickel alloy are investigated and compared at high positive overpotentials and in 0.5 M NaCl(aq). Abrupt potential-dependent passive film breakdown is observed for both Cu and Cu-Ni alloys during voltammetry and during chrono-amperometry experiments. For Cu a single transitions occurs at 0.2 V vs. SCE consistent with a Cu(II/I) process leading to interfacial stress and breaking of a passive CuCl film. For Cu-Ni alloy, two stages are observed at 0.3 V vs. SCE due to a Cu(II/I) process and at 1.7 V vs. SCE due to a sub-interfacial Ni(IV/II) process. A breakdown mechanism is proposed based on redox processes at the buried interface at the metallic conductor | passive ion conductor junction.