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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Brändli, Christof
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2024Revealing the impact of viscoelastic characteristics on performance parameters of UV-crosslinked hotmelt pressure-sensitive adhesives : insights from time-temperature superposition analysiscitations
- 2022Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasmacitations
- 2022Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demandcitations
- 2021Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasmacitations
- 2021Improving the filament weld-strength of Fused Filament Fabrication products through improved interdiffusioncitations
- 2018The art of adhesive formulation to meet the requirements of specific industrial applications
- 2016Basic study on the evaluation of thermoplastic polymers as hot-melt adhesives for mixed-substrate joining
Places of action
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article
Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma
Abstract
<jats:title>Abstract</jats:title><jats:p>Smooth polystyrene (PS) and polyamide 12 (PA 12) surfaces were produced via an injection molding process followed by a smoothing process and subsequently treated with O<jats:sub>2</jats:sub> plasma to increase the number of polar groups capable of hydrogen bond formation on the surface. The presence of related groups was evident from X‐ray photoelectron spectroscopy (XPS) and contact angle measurements. The sample topographies were investigated by atomic force microscopy (AFM). The plasma treatment allowed the joining of the substrates without adhesive by pressing the substrates together below or around the glass transition temperature. Notably, not only substrates of the same polymer but also PS and PA 12, which are incompatible, were joined with this method. The adhesion between the substrates was determined using a LUMifrac apparatus. The adhesion strength increased with increasing bonding temperature and when both substrates were plasma‐treated, reaching adhesive strengths up to 5.5 ± 1.7 MPa. Remarkably, the joint substrates could be rapidly de‐bonded on demand simply by treatment with water, and the separated substrates could be re‐bonded by renewed plasma treatment.</jats:p>