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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Mannsfeld, Stefan C. B.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2024Impact of Thermal Annealing on the Dissolution of Semiconducting Polymer Thin Filmscitations
- 2024Eco‐Friendly Approach to Ultra‐Thin Metal Oxides‐ Solution Sheared Aluminum Oxide for Half‐Volt Operation of Organic Field‐Effect Transistorscitations
- 2023Tailoring the Morphology of a Diketopyrrolopyrrole-based Polymer as Films or Wires for High-Performance OFETs using Solution Shearingcitations
- 2023Band Structure Engineering in Highly Crystalline Organic Semiconductorscitations
- 2023On-water surface synthesis of electronically coupled 2D polyimide-MoS2 van der Waals heterostructurecitations
- 2023Influence of chemical interactions on the electronic properties of BiOI/organic semiconductor heterojunctions for application in solution-processed electronics
- 2022Thermal behavior and polymorphism of 2,9-didecyldinaphtho[2,3-b:2′,3′-f]thieno[3,2-b] thiophene thin filmscitations
- 2022Investigating the morphology of bulk heterojunctions by laser photoemission electron microscopycitations
- 2021Band gap engineering in blended organic semiconductor films based on dielectric interactionscitations
- 2021Ultrasoft and High-Mobility Block Copolymers for Skin-Compatible Electronics
- 2021Ultrasoft and High‐Mobility Block Copolymers for Skin‐Compatible Electronicscitations
- 2020Near–atomic-scale observation ofgrain boundaries inalayer-stacked two-dimensional polymercitations
- 2020Ultrasoft and High-Mobility Block Copolymers for Skin-Compatible Electronics
- 2019Anisotropic Polaron Delocalization in Conjugated Homopolymers and Donor-Acceptor Copolymerscitations
- 2019Effect of H- and J-Aggregation on the Photophysical and Voltage Loss of Boron Dipyrromethene Small Molecules in Vacuum-Deposited Organic Solar Cellscitations
- 2019Mitigating Meniscus Instabilities in Solution-Sheared Polymer Films for Organic Field-Effect Transistorscitations
- 2018Alkyl Branching Position in Diketopyrrolopyrrole Polymerscitations
- 2014One-dimensional self-confinement promotes polymorph selection in large-area organic semiconductor thin filmscitations
Places of action
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article
Impact of Thermal Annealing on the Dissolution of Semiconducting Polymer Thin Films
Abstract
<p>Here, the effect of thermal annealing (TA) on the stability of solution-sheared thin films of the semiconducting polymer poly[2,5-bis(2-octyldodecyl)pyrrolo[3,4-c]pyrrole-1,4(2H,5H)-dione-3,6-diyl)-alt-(2,2′;5′,2′’;5′’,2′’’-quaterthiophen-5,5′’’-diyl)] (PDPP4T) against the original coating solvent is studied, and it is shown that TA significantly improves the solvent resistance of semiconducting polymer films. Specifically, after the thin films are annealed at or above a critical temperature, the thin film thickness is largely retained when exposed to the original solvent, while for lower annealing temperatures material loss occurs, i.e., the thin film thickness is reduced due to rapid dissolution. The results of various techniques including grazing-incidence wide-angle x-ray scattering (GIWAXS), atomic force microscopy (AFM), and ultraviolet-visible-near infrared (UV–vis-NIR) absorption spectroscopy suggest physical changes as the cause for the increased solvent resistance. Such annealed films also show stable electrical characteristics in bottom-gate, top-contact (BGTC) organic field-effect transistors (OFETs) even after solvent exposure. In initial tests, a multitude of technologically relevant polymers show such behavior, underlining the potential impact of such temperature treatments for the fabrication of multi-layer polymer devices.</p>