| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Kostka, Aleksander
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (39/39 displayed)
- 2024Sputter‐deposited La–Co–Mn–O nanocolumns as stable electrocatalyst for the oxygen evolution reaction
- 2024A sustainable CVD approach for ZrN as a potential catalyst for nitrogen reduction reaction
- 2024Wafer‐Scale Demonstration of Polycrystalline MoS<sub>2</sub> Growth on 200 mm Glass and SiO<sub>2</sub>/Si Substrates by Plasma‐Enhanced Atomic Layer Depositioncitations
- 2023Deformation-induced homogenization of the multi-phase senary high-entropy alloy MoNbTaTiVZr processed by high-pressure torsioncitations
- 2023Microstructure and mechanical properties of a Ni-based superalloy thin film investigated by micropillar compressioncitations
- 2023Microscale combinatorial libraries for the discovery of high-entropy materialscitations
- 2022Linear growth of reaction layer during in-situ TEM annealing of thin film Al/Ni diffusion couplescitations
- 2022Influence of the PTFE membrane thickness on the CO<sub>2</sub> electroreduction performance of sputtered Cu‐PTFE gas diffusion electrodescitations
- 2022Nucleation and growth studies of large-area deposited WS(_2) on flexible substrates
- 2021Influence of low Bi contents on phase transformation properties of VO<sub>2</sub> studied in a VO<sub>2</sub>:Bi thin film librarycitations
- 2021Laser metal deposition of refractory high-entropy alloys for high-throughput synthesis and structure-property characterization
- 2021Laser metal deposition of Al0.6CoCrFeNi with Ti & C additions using elemental powder blendscitations
- 2021Direct liquid injection chemical vapor deposition of ZrO2 films from a heteroleptic Zr precursor: Interplay between film characteristics and corrosion protection of stainless steelcitations
- 2020Experimental and theoretical investigation on phase formation and mechanical properties in Cr-Co-Ni alloys processed using a novel thin-film quenching techniquecitations
- 2020Structure Zone Investigation of Multiple Principle Element Alloy Thin Films as Optimization for Nanoindentation Measurementscitations
- 2020Correlative chemical and structural investigations of accelerated phase evolution in a nanocrystalline high entropy alloycitations
- 2020Structure zone investigation of multiple principle element alloy thin films as optimization for nanoindentation measurements
- 2020Effect of grain statistics on micromechanical modeling
- 2020High-throughput characterization of Ag–V–O nanostructured thin-film materials libraries for photoelectrochemical solar water splittingcitations
- 2019Misorientation-dependent solute enrichment at interfaces and its contribution to defect formation mechanisms during laser additive manufacturing of superalloyscitations
- 2019Effects of the Ion to growth flux ratio on the constitution and mechanical properties of Cr1–x-Alx-N thin filmscitations
- 2019Stress-induced formation of TCP phases during high temperature low cycle fatigue loading of the single-crystal Ni-base superalloy ERBO/1citations
- 2018Investigation of Vanadate-metal-oxide thin film systems for solar water splitting
- 2018Atomic-scale investigation of fast oxidation kinetics of nanocrystalline CrMnFeCoNi thin filmscitations
- 2018Combinatorial synthesis and high-throughput characterization of Fe-V-O thin-film materials libraries for solar water splittingcitations
- 2016Transmission electron microscopy of a CMSX-4 Ni-base superalloy produced by selective electron beam melting
- 2015Microsegregation and precipitates of an as-cast Co-based superalloycitations
- 2015Nanoindentation studies of the mechanical properties of the mu phase in a creep deformed Re containing nickel-based superalloycitations
- 2015The nucleation of Mo-rich Laves phase particles adjacent to M23C6 micrograin boundary carbides in 12% Cr tempered martensite ferritic steels
- 2015CNT-TiO(_{2-delta}) composites for improved co-catalyst dispersion and stabilized photocatalytic hydrogen production
- 2014Shear-Induced Mixing Governs Codeformation of Crystalline-Amorphous Nanolaminatescitations
- 2013Interface Segregation in Advanced Steels Studied at the Atomic Scale
- 2013Simple synthesis of superparamagnetic magnetite nanoparticles as highly efficient contrast agentcitations
- 2012On the Correlation Between Thermal Cycle and Formation of Intermetallic Phases at the Interface of Laser-Welded Aluminum-Steel Overlap Jointscitations
- 2012Microstructural evolution of a Ni-based superalloy (617B) at 700 degrees C studied by electron microscopy and atom probe tomographycitations
- 2011On the formation and growth of intermetallic phases during interdiffusion between low-carbon steel and aluminum alloyscitations
- 2009Microstructure characterization of tool steel claddings co-extruded on low alloyed steel substrates
- 2009Microstructure of friction stir welding of aluminium alloy to magnesium alloy
- 2008Influence of nitridation on surface microstructure and properties of graded cemented carbides with Co and Ni binders
Places of action
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article
Wafer‐Scale Demonstration of Polycrystalline MoS<sub>2</sub> Growth on 200 mm Glass and SiO<sub>2</sub>/Si Substrates by Plasma‐Enhanced Atomic Layer Deposition
Abstract
<jats:title>Abstract</jats:title><jats:p>2D materials like transition metal dichalcogenides (TMDCs) have been widely studied and are a gateway to modern technologies. While research today is mostly carried out on a laboratory scale, there is an intensive need for reliable processes on a wafer‐scale, starting with monolayer‐precise deposition of high‐quality films. In this work, a plasma‐enhanced atomic layer deposition (PEALD) process is developed on a 200 mm SiO<jats:sub>2</jats:sub>/Si substrate. The layers are investigated regarding crystallinity, composition, homogeneity, microstructure, topography, and electrical properties. The process is then applied on 200 mm alkali‐free glass wafers aiming toward flexible electronics and compatibility with Si processes. A complete coverage of the wafer with a satisfying uniformity is achieved on both substrates and direct polycrystalline growth of MoS<jats:sub>2</jats:sub> films is verified on the entire wafer at a substrate temperature of <jats:italic>T </jats:italic>= 230 °C. On glass, the deposited MoS<jats:sub>2</jats:sub> films exhibit a higher crystallinity and are more planar compared to the SiO<jats:sub>2</jats:sub>/Si substrate. Furthermore, application relevant few‐nanometer thick layers are investigated in detail. This low‐temperature process inspires optimism for future direct integration of 2D‐materials in an economical bottom‐up approach on a wide variety of substrates, thus paving the way for industrial mass production.</jats:p>