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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Vellaisamy, Arul Lenus Roy
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 20242D MXene Interface Engineered Bismuth Telluride Thermoelectric Module with Improved Efficiency for Waste Heat Recoverycitations
- 2023Facile composite engineering to boost thermoelectric power conversion in ZnSb devicecitations
- 20233D Architectural MXene‐based Composite Films for Stealth Terahertz Electromagnetic Interference Shielding Performancecitations
- 2023Dispersion of InSb Nanoinclusions in Cu<sub>3</sub>SbS<sub>4</sub> for Improved Stability and Thermoelectric Efficiencycitations
- 2023Eco-Friendly Cerium–Cobalt Counter-Doped Bi2Se3 Nanoparticulate Semiconductorcitations
- 2022Hierarchically Interlaced 2D Copper Iodide/MXene Composite for High Thermoelectric Performancecitations
- 2022Amorphous carbon nano-inclusions for strategical enhancement of thermoelectric performance in Earth-abundant Cu3SbS4citations
- 2022Probing the Effect of MWCNT Nanoinclusions on the Thermoelectric Performance of Cu3SbS4 Compositescitations
- 2022Thermoelectric properties of sulfide and selenide-based materialscitations
- 2022Insights into the Classification of Nanoinclusions of Composites for Thermoelectric Applicationscitations
- 2021Ultralow Thermal Conductivity in Dual-Doped n-Type Bi2Te3 Material for Enhanced Thermoelectric Propertiescitations
- 2021Current advancements on charge selective contact interfacial layers and electrodes in flexible hybrid perovskite photovoltaicscitations
- 2021Effective decoupling of seebeck coefficient and the electrical conductivity through isovalent substitution of erbium in bismuth selenide thermoelectric materialcitations
- 2019Simultaneous Enhancement of Thermopower and Electrical Conductivity through Isovalent Substitution of Cerium in Bismuth Selenide Thermoelectric Materialscitations
- 2019Efficient oxygen electroreduction kinetics by titanium carbide@nitrogen doped carbon nanocompositecitations
- 2019Influence of nitrogen dopant source on the structural, photoluminescence and electrical properties of ZnO thin films deposited by pulsed spray pyrolysiscitations
- 2007Nanocomposite field effect transistors based on zinc oxide/polymer blendscitations
- 2004Influence of the substrate temperature to the performance of tris (8-hydroxyquinoline) aluminum based organic light emitting diodescitations
Places of action
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article
3D Architectural MXene‐based Composite Films for Stealth Terahertz Electromagnetic Interference Shielding Performance
Abstract
<jats:title>Abstract</jats:title><jats:p>The terahertz frequency range is gaining popularity in security, stealth technology, and the future 6G network communication. For the control of severe terahertz electromagnetic interference (EMI) pollution, frequency‐selective stealth‐capable shielding materials are being explored to mask terahertz signals. For the realization of masking terahertz signals, the robustness, lightweight, and shape‐conformable materials with excellent terahertz EMI shielding/absorption are crucial. Here, the study reports the fabrication of 3D symmetric pyramidal architectural MXene composite films with frequency‐selective stealth performance characteristics via the facile drop casting method. With the high absorption capability of 2D MXene layers, the MXene composite films exhibit substantial terahertz stealth performance. 3D pyramidal microstructure design leads to frequency selective surface‐assisted reflection resonance in the frequency range of 0.6–1.1 THz. The MXene composite film demonstrates an outstanding maximum terahertz shielding effectiveness (SE) of up to 70.4 dB and a specific SE of 0.55 dB µm<jats:sup>−1</jats:sup>. These terahertz SE values exceed all of those for MX‐based shielding material designs reported in the literature. The investigation will open a new direction toward developing terahertz EMI shielding thin films with easy integration into any surface for stealth capabilities.</jats:p>