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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Hatanpää, Timo Tapio
University of Helsinki
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (29/29 displayed)
- 2024Atomic Layer Deposition of Molybdenum Carbide Thin Filmscitations
- 20243D-printed sensor electric circuits using atomic layer depositioncitations
- 2023Conversion of ALD CuO Thin Films into Transparent Conductive p-Type CuI Thin Filmscitations
- 2021Highly conductive and stable Co9S8 thin films by atomic layer depositioncitations
- 2019Atomic layer deposition of tin oxide thin films from bis[bis(trimethylsilyl)amino]tin(II) with ozone and watercitations
- 2019Crystalline tungsten sulfide thin films by atomic layer deposition and mild annealingcitations
- 2019Atomic Layer Deposition of Nickel Nitride Thin Films using NiCl2(TMPDA) and Tert‐Butylhydrazine as Precursorscitations
- 2019Nickel Germanide Thin Films by Atomic Layer Depositioncitations
- 2019Atomic layer deposition of cobalt(II) oxide thin films from Co(BTSA)(2)(THF) and H2Ocitations
- 2019Atomic Layer Deposition of Intermetallic Co3Sn2 and Ni3Sn2 Thin Filmscitations
- 2019Atomic Layer Deposition of PbI₂ Thin Filmscitations
- 2018Diamine Adduct of Cobalt(II) Chloride as a Precursor for Atomic Layer Deposition of Stoichiometric Cobalt(II) Oxide and Reduction Thereof to Cobalt Metal Thin Filmscitations
- 2017Thermal Atomic Layer Deposition of Continuous and Highly Conducting Gold Thin Filmscitations
- 2017Atomic layer deposition of tin oxide thin films from bis[bis(trimethylsilyl)amino]tin(II) with ozone and watercitations
- 2017Atomic Layer Deposition of Crystalline MoS2 Thin Filmscitations
- 2017Studies on Thermal Atomic Layer Deposition of Silver Thin Filmscitations
- 2016Potential gold(I) precursors evaluated for atomic layer depositioncitations
- 2016Atomic Layer Deposition of Metal Phosphates and Lithium Silicates
- 2016Bismuth iron oxide thin films using atomic layer deposition of alternating bismuth oxide and iron oxide layerscitations
- 2014Metal oxide films
- 2012Study of amorphous lithium silicate thin films grown by atomic layer depositioncitations
- 2012Lithium Phosphate Thin Films Grown by Atomic Layer Depositioncitations
- 2011Iridium metal and iridium oxide thin films grown by atomic layer deposition at low temperaturescitations
- 2011Atomic Layer Deposition of GeTe
- 2011Crystal structures and thermal properties of some rare earth alkoxides with tertiary alcoholscitations
- 2009Atomic layer deposition of metal tellurides and selenides using alkylsilyl compounds of tellurium and seleniumcitations
- 2009Alkylsilyl compounds of selenium and tellurium
- 2007Study of a novel ALD process for depositing MgF2 thin filmscitations
- 2007Radical-enhanced atomic layer deposition of silver thin films using phosphine-adducted silver carboxylatescitations
Places of action
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article
Conversion of ALD CuO Thin Films into Transparent Conductive p-Type CuI Thin Films
Abstract
Copper iodide (CuI) is a high-performance p-type transparent semiconductor that can be used in numerous applications, such as transistors, diodes, and solar cells. However, the lack of conformal and scalable methods to deposit CuI thin films limits its establishment in applications that involve complex-shaped and/or large substrate areas. In this work, atomic layer deposition (ALD) is employed to enable scalable and conformal thin film deposition. A two-step approach relying on ALD of CuO and its subsequent conversion to CuI via exposure to HI vapor at room temperature is demonstrated. The resulting CuI films are phase-pure, uniform, and of high purity. Furthermore, CuI films on several substrates such as Si, amorphous Al2O3, n-type TiO2, and gamma-CsPbI3 perovskite are prepared. With the resulting n-TiO2/p-CuI structure, the easy and straightforward fabrication of a diode structure as a proof-of-concept device is demonstrated. Moreover, the successful deposition of CuI on gamma-CsPbI3 proves the compatibility of the process for using CuI as the hole transport layer in perovskite solar cell applications in the nip-configuration. It is believed that the ALD-based approach described in this work will offer a viable alternative for depositing transparent conductive p-type CuI thin films in applications that involve complex high aspect ratio structures and large substrate areas. ; Peer reviewed