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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Kočí, Jan | Prague |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Galbán, Javier
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article
Uncapped gold nanoparticles for the metallization of organic monolayers
Abstract
Deposition of the top-contact electrode to create large-area electrode | monolayer | electrode junctions represents a contemporary challenge to the integration of molecular electronic phenomena into device structures. Here, a top contact electrode is formed on top of an organic monolayer over a large area (cm2) by two simple, sequential self-assembly steps. Initial self-assembly of 4,4′-(1,4-phenylenebis(ethyne-2,1-diyl))dianiline onto gold-on-glass substrates gives high-quality monolayers. The exposed amine functionality is subsequently used to anchor uncapped gold nanoparticles deposited in a second self-assembly step. These uncapped gold nanoparticles are prepared by thermolysis of lipoic acid stabilized gold nanoclusters and contain gold oxide (≈9%) that provides stability in the absence of an organic capping ligand. This two-step procedure results in full coverage of the monolayer by the densely packed gold nanoparticles, which spontaneously condense to give a semi-continuous film. The electrical properties of these junctions are determined from I–V curves, revealing uniform electrical response and absence of metallic short-circuits or evidence of damage to the underlying molecular monolayer. These promising electrical characteristics suggest that the deposition of uncapped gold nanoparticles on suitably functionalized molecular monolayers provides a path for the fabrication of molecular electronic devices using simple methodologies. ; P.C., J.L.S., S. Martín, and J.G. are grateful for financial assistance from Ministerio de Ciencia e Innovación from Spain and fondos FEDER in the framework of projects PID2019-105881RB-I00, PID2019-105408GB-I00, and PGC2018-097583-B-I00. J.L.S. also acknowledges the funded project Hierarchical Self Assembly of Polymeric Soft Systems, “SASSYPOL,” from the 7th Framework Programme (CEE, Ref-607602). L.H., S. Martín, J.L.S, P.C., S. de Marcos, and J.G. acknowledge support from DGA/Fondos FEDER (construyendo Europa desde Aragón) for funding PLATON (E31_20R), CLIP (E47_17R) and ...