693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Desmulliez, Mpy
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (49/49 displayed)
- 2023Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coatingcitations
- 2022Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallizationcitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2020Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systemscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Photolithographic nanoseeding method for selective synthesis of metal-catalysed nanostructurescitations
- 2019Miniaturized 3-D Cross-Type Receiver for Wirelessly Powered Capsule Endoscopycitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018Nanocomposite-Based Microstructured Piezoresistive Pressure Sensors for Low-Pressure Measurement Rangecitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2016Progress towards a multi-modal capsule endoscopy device featuring microultrasound imagingcitations
- 2016Carbon screen-printed electrodes on ceramic substrates for label-free molecular detection of antibiotic resistancecitations
- 2016A wafer mapping technique for residual stress in surface micromachined filmscitations
- 2015Electrodeposited magnetostrictive Fe-Ga alloys for miniaturised actuatorscitations
- 2015Microwave and thermal curing of an epoxy resin for microelectronic applicationscitations
- 2015Computational electrohydrodynamics in the fabrication of hollow polymer microstructurescitations
- 2015Fabrication of electrodeposited Ni-Fe cantilevers for magnetic MEMS switch applicationscitations
- 2014Characterization and Development of Materials for an Integrated High-Temperature Sensor Using Resistive Test Structures
- 2014Integration of Microfluidic Channels with Frequency Selective Surfaces for Sensing and Tuningcitations
- 2014Statistical analysis of stencil technology for wafer-level bumpingcitations
- 2013Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresistcitations
- 2013Microstructure formation in a thick polymer by electrostatic-induced lithographycitations
- 2012On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substratescitations
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2011Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications
- 2011Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications
- 2011Hermetic glass frit packaging in air and vacuum with localized laser joiningcitations
- 2010An additive method for photopatterning of metals on flexible substratescitations
- 2010Influence of pulse reverse plating on the properties of Ni-Fe thin filmscitations
- 2010Bespoke interconnect technologies for optoelectronic and biomedical products
- 2010Silver nanocluster formation using UV radiation for direct metal patterning on polyimidecitations
- 2010High-aspect-ratio metal microchannel plates for microelectronic cooling applicationscitations
- 2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographycitations
- 2009Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling platecitations
- 2009Design, fabrication, and characterization of flip-chip bonded microinductorscitations
- 2009Design methodology and fabrication process of a microinductor for the next generation of DC-DC power converterscitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2008Adaptive packaging solution for a microlens array placed over a micro-UV-LED arraycitations
- 2008Design methodology and manufacture of a microinductorcitations
- 2008Megasonic enhanced electrodepositioncitations
- 2008Open-ended microwave oven for flip-chip assemblycitations
- 2008Megasonic enhanced wafer bumping process to enable high density electronics interconnectioncitations
- 2006Assessment of microinductors for DC-DC converters
- 2004Design, manufacture and testing of a low-cost micro-channel cooling device
- 2004Design, manufacture and testing of a low-cost micro-channel cooling device
Places of action
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article
A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide
Abstract
In this work, a method for the rapid synthesis of metallic microtracks on polyetherimide is presented. The method relies on the photosynthesis of silver nanoparticles on the surface of the polymer substrates from photosensitive silver chloride (AgCl), which is synthesized directly on the polyetherimide surface. The study reveals that the use of AgCl as a photosensitive intermediate accelerates the reactions leading to the formation of silver nanoparticles by up to two orders of magnitude faster than other photodecomposition schemes. The patterning can be conducted under blue light, with notable advantages over UV exposure. Polymers of significant interest to the microelectronics and 3D printing industries can be directly patterned by light using this photography-inspired technique at throughputs high enough to be commercially advantageous. Light exposures as short as a few seconds are sufficient to allow the direct metallization of the illuminated polyetherimide surface. The results show that the silver required for the seed layer is minimal, and the later copper electroless plating results in the selective growth of conductive tracks for circuitry on the light-patterned areas, both on flexible films and 3D printed surfaces.