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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Jones, Thomas David Arthur
University of Dundee
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2024Demonstration of a high-performance continuous casting process for cobalt alloy ASTM F75
- 2022Inkjet printing of high-concentration particle-free platinum inkscitations
- 2021Phase Field & Monte Carlo Potts Simulation of Grain Growth and Morphology of Vertically Upwards Cast Oxygen Free Copper
- 2021Optimising Computational Fluid Dynamic Conditions for Simulating Copper Vertical Castingcitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018Copper electroplating of PCB interconnects using megasonic acoustic streamingcitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2017Enhanced electrodeposition for the filling of micro-vias
- 2016Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industrycitations
Places of action
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article
A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide
Abstract
In this work, a method for the rapid synthesis of metallic microtracks on polyetherimide is presented. The method relies on the photosynthesis of silver nanoparticles on the surface of the polymer substrates from photosensitive silver chloride (AgCl), which is synthesized directly on the polyetherimide surface. The study reveals that the use of AgCl as a photosensitive intermediate accelerates the reactions leading to the formation of silver nanoparticles by up to two orders of magnitude faster than other photodecomposition schemes. The patterning can be conducted under blue light, with notable advantages over UV exposure. Polymers of significant interest to the microelectronics and 3D printing industries can be directly patterned by light using this photography-inspired technique at throughputs high enough to be commercially advantageous. Light exposures as short as a few seconds are sufficient to allow the direct metallization of the illuminated polyetherimide surface. The results show that the silver required for the seed layer is minimal, and the later copper electroless plating results in the selective growth of conductive tracks for circuitry on the light-patterned areas, both on flexible films and 3D printed surfaces.