| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Bund, Andreas
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024A Novel Method for Preparation of Al–Ni Reactive Coatings by Incorporation of Ni Nanoparticles into an Al Matrix Fabricated by Electrodeposition in AlCl<sub>3</sub>:1‐Eethyl‐3‐Methylimidazolium Chloride (1.5:1) Ionic Liquid Containing Ni Nanoparticles
- 2024Integration of Multijunction Absorbers and Catalysts for Efficient Solar‐Driven Artificial Leaf Structures: A Physical and Materials Science Perspectivecitations
- 2023Analysis of Pre-Treatment Processes to Enable Electroplating on Nitrided Steel
- 2023Electrochemical reduction of tantalum and titanium halides in 1-butyl-1-methylpyrrolidinium bis (trifluoromethyl-sulfonyl)imide and 1-butyl-1-methylpyrrolidinium trifluoromethanesulfonate ionic liquids
- 2023Quasi-in-Situ Analysis of Electropolished Additively Manufactured Stainless Steel Surfaces
- 2022Hollow platinum-gold and palladium-gold nanoparticles: synthesis and characterization of composition-structure relationshipcitations
- 2022Corrosion Properties of Ni-P-B Dispersion Coating for Industrial Knives and Bladescitations
- 2022Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulsescitations
- 2021Selective metallization of polymers: surface activation of polybutylene terephthalate (PBT) assisted by picosecond laser pulsescitations
- 2021The need for digitalisation in electroplating – How digital approaches can help to optimize the electrodeposition of chromium from trivalent electrolytes
- 2021Anti-corrosive siloxane coatings for improved long-term performance of supercapacitors with an aqueous electrolytecitations
- 2021Analysis of the physical and photoelectrochemical properties of c-Si(p)/a-SiC:H(p) photocathodes for solar water splittingcitations
- 2020Aluminium-poly(3,4-ethylenedioxythiophene) rechargeable battery with ionic liquid electrolytecitations
- 2019Relation between color and surface morphology of electrodeposited chromium for decorative applicationscitations
- 2019Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting pointscitations
- 2019Electrochemical deposition of silicon from a sulfolane-based electrolyte: effect of applied potentialcitations
- 2019Nanoscale morphological changes at lithium interface, triggered by the electrolyte composition and electrochemical cyclingcitations
- 2018Structure and formation of trivalent chromium conversion coatings containing cobalt on zinc plated steelcitations
- 2017An electrochemical quartz crystal microbalance study on electrodeposition of aluminum and aluminum-manganese alloyscitations
- 2016Ultrasound assisted electrodeposition of Zn and Zn-TiO2 coatingscitations
- 2012Electrochemical supercapacitors based on a novel graphene/conjugated polymer composite systemcitations
- 2010Do solvation layers of ionic liquids influence electrochemical reactions?citations
- 2009Novel amino-acid-based polymer/multi-walled carbon nanotube bio-nanocompositescitations
Places of action
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article
Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses
Abstract
<jats:sec><jats:label /><jats:p>The selective metallization of nonconductive polymer materials has broad applications in the fields of integrated circuit technology and metallized patterns. This work discusses a methodology to pattern metal tracks on polybutylene terephthalate substrates. The process consists of three steps: 1) surface patterning with picosecond laser pulses (1030 nm) in air, 2) Pd seeding via treatment in PdCl<jats:sub>2</jats:sub>solution, and 3) selective metallization via electroless copper deposition. Picosecond laser irradiation promotes not only surface roughening but also chemical modification to enable Pd seeding as the polymer surface acquires the ability to reduce Pd(II)‐chloride species to metallic Pd. The laser parameters, as well as the PdCl<jats:sub>2</jats:sub>concentration and seeding temperature, have an influence on the polymer surface morphology, the concentration and distribution of metallic Pd, and the copper layer properties. Homogeneous copper layers with well‐defined geometries, good coating‐substrate adhesion, and high electrical conductivity can be obtained. This is ascribed to the synergistic effect of the chemical surface activation and roughness development (from 0.13 to ≈1.6 μm). As the patterning and surface activation are performed in air, directly on the as‐received polymer substrate, this methodology shows great potential for metallization of electronic devices with 3D complex geometries.</jats:p></jats:sec>