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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Grieseler, Rolf
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2023Phase formation of cubic silicon carbide from reactive silicon-carbon multilayerscitations
- 2022Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulsescitations
- 2021Selective metallization of polymers: surface activation of polybutylene terephthalate (PBT) assisted by picosecond laser pulsescitations
- 2021Analysis of the physical and photoelectrochemical properties of c-Si(p)/a-SiC:H(p) photocathodes for solar water splittingcitations
- 2020Capacitance voltage curve simulations for different passivation parameters of dielectric layers on silicon
- 2020Silicon interface passivation studied by modulated surface photovoltage spectroscopycitations
- 2018Magnetron sputtered AlN layers on LTCC multilayer and silicon substratescitations
- 2015Untersuchung der Eigenschaften sowie der Anwendung von reaktiven Mehrschichtsystemen in der Aufbau- und Verbindungstechnik
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article
Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses
Abstract
<jats:sec><jats:label /><jats:p>The selective metallization of nonconductive polymer materials has broad applications in the fields of integrated circuit technology and metallized patterns. This work discusses a methodology to pattern metal tracks on polybutylene terephthalate substrates. The process consists of three steps: 1) surface patterning with picosecond laser pulses (1030 nm) in air, 2) Pd seeding via treatment in PdCl<jats:sub>2</jats:sub>solution, and 3) selective metallization via electroless copper deposition. Picosecond laser irradiation promotes not only surface roughening but also chemical modification to enable Pd seeding as the polymer surface acquires the ability to reduce Pd(II)‐chloride species to metallic Pd. The laser parameters, as well as the PdCl<jats:sub>2</jats:sub>concentration and seeding temperature, have an influence on the polymer surface morphology, the concentration and distribution of metallic Pd, and the copper layer properties. Homogeneous copper layers with well‐defined geometries, good coating‐substrate adhesion, and high electrical conductivity can be obtained. This is ascribed to the synergistic effect of the chemical surface activation and roughness development (from 0.13 to ≈1.6 μm). As the patterning and surface activation are performed in air, directly on the as‐received polymer substrate, this methodology shows great potential for metallization of electronic devices with 3D complex geometries.</jats:p></jats:sec>