| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Słoma, Marcin
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (21/21 displayed)
- 2022Electromagnetic field controlled domain wall displacement for induced strain tailoring in BaTiO3-epoxy nanocompositecitations
- 2021Additive manufacturing of electronics from silver nanopowders sintered on 3D printed low-temperature substratescitations
- 2021Carbon nanotube-based composite filaments for 3d printing of structural and conductive elementscitations
- 2020Conductive ABS/Ni Composite Filaments for Fused Deposition Modeling of Structural Electronicscitations
- 2020Flexible Gas Sensor Printed on a Polymer Substrate for Sub-ppm Acetone Detectioncitations
- 2019Mechanical and thermal properties of ABS/iron composite for fused deposition modelingcitations
- 2019Photonic curing of silver paths on 3D printed polymer substratecitations
- 2019Heterophase materials for fused filament fabrication of structural electronicscitations
- 2018Electrically conductive acrylonitrile butadiene styrene(ABS)/copper composite filament for fused deposition modelingcitations
- 2018Characterization of PMMA/BaTiO3 Composite Layers Through Printed Capacitor Structures for Microwave Frequency Applicationscitations
- 2016Microwave properties of sphere-, flake-, and disc-shaped BaFe<inf>12</inf>O<inf>19</inf> nanoparticle inks for high-frequency applications on printed electronicscitations
- 2016Rheology of inks for various techniques of printed electronicscitations
- 2015Perovskite-type KTaO 3–reduced graphene oxide hybrid with improved visible light photocatalytic activitycitations
- 2015Influence of electric field on separation and orientation of carbon nanotubes in spray coated layerscitations
- 2015Simple optical method for recognizing physical parameters of graphene nanoplatelets materials
- 2014Thick Film Polymer Composites with Graphene Nanoplatelets for Use in Printed Electronics citations
- 2014Optical measurements of selected properties of nanocomposite layers with graphene and carbon nanotubes fillerscitations
- 2013Miniaturized coupled-line directional coupler designed with the use of photoimageable Thick-Film technology
- 2012Screen printed polymer pastes with carbon nanotubes for printed electronics applications
- 2012SAC 305 solder paste with carbon nanotubes - Part I: Investigation of the influence of the carbon nanotubes on the SAC solder paste propertiescitations
- 2010Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder jointscitations
Places of action
| Organizations | Location | People |
|---|
article
Additive manufacturing of electronics from silver nanopowders sintered on 3D printed low-temperature substrates
Abstract
Additive manufacturing is more widely used these days in aerospace, power industry, and automotive. The latest reports indicate that electronics can be produced with this technique. This approach requires the development of new materials for the fabrication of conductive metallic layers on polymers. Herein, a hybrid technique based on fused deposition modeling, direct‐write, and selective laser sintering is demonstrated, for the fabrication of structural electronics. Highly conductive paths are obtained with conductivity values up to 3.2·10<sup>6</sup> S m<sup>−1</sup> in a single printing and sintering additive process. The influence of process parameters is evaluated with several 3D printed polymer substrates affecting the electrical conductivity of the printed conductive paths and circuits. The developed hybrid technique allows performing selective thermal sintering of metallic pastes on polymer substrates exhibiting the value of melting temperatures much lower than the sintering temperature of the silver paste. This phenomenon can be explained with the proposed hypothesis that the activation energy of the sintering process of metallic paste and degradation of polymer substrate plays a key role in obtaining functional conductive metallic paths on polymer substrates. Application of the developed process is demonstrated with a simple human interface device and a circuit with light‐emitting diodes and power source.