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Koneti, Siddhardha
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document
Influence of Cu content on the structural and morphological features of TixCuy intermetallic thin films for biosignals acquisition
Abstract
Thin films synthesized by Physical Vapor Deposition (PVD) are currently being studied to be used in different types of sensors [1,2]. Among these, sensors and electrodes used for biomedical devices are particularly important since they allow the conversion of one or more measured signals of any living tissue into other quantities, usually an electrical signal. Beyond the electrical response, a biomedical sensor should also be biocompatible and totally innocuous for the patient. Additionally, some degree of antibacterial effect is considered as a further asset for the sensor. The Ti‐Cu system perfectly meets such requirements, Ti being biocompatible, while Cu is relevant for its antibacterial character. The objective of this study is to deeply characterize the nature and microstructure of Ti‐Cu films in order to better understand and optimize the sensor response.Films are deposited by a PVD magnetron sputtering process from a composite Ti‐Cu target. Their chemistry, morphology and fine microstructure are characterized by X‐Ray diffraction, Rutherford Backscattering Spectrometry, Scanning and Transmission Electron Microscopies.Results show that three main zones were distinguished, in relation to the Cu/Ti atomic ratio in the films. SEM reveals that the morphology of micrometre-thick films changed from a columnar to an amorphous‐like microstructure. XRD diffraction indicated that the hcp‐Ti structure dominates for low Cu/Ti ratios. For higher Cu contents, the formation of Ti‐Cu intermetallic phases was noticed which becomes more clear and obvious for the third zone (Cu contents above 75 at.%). HR‐TEM and STEM observations confirm the presence of nanocrystallites embedded into an amorphous matrix (Fig. 1). A further chemical characterisation allowed the identification of the nature of intermetallics, which contributed to explaining sensors' electrical behaviours (Fig. 2).