People | Locations | Statistics |
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Ferrari, A. |
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Schimpf, Christian |
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Dunser, M. |
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Thomas, Eric |
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Gecse, Zoltan |
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Tsrunchev, Peter |
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Della Ricca, Giuseppe |
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Cios, Grzegorz |
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Hohlmann, Marcus |
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Dudarev, A. |
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Mascagna, V. |
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Santimaria, Marco |
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Poudyal, Nabin |
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Piozzi, Antonella |
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Mørtsell, Eva Anne |
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Jin, S. |
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Noel, Cédric |
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Fino, Paolo |
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Mailley, Pascal |
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Meyer, Ernst |
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Zhang, Qi |
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Pfattner, Raphael | Brussels |
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Kooi, Bart J. |
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Babuji, Adara |
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Pauporte, Thierry |
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Bartsch, Heike
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2021Phase Transformation and Characterization of 3D Reactive Microstructures in Nanoscale Al/Ni Multilayerscitations
- 2021Functionalized three-dimensional multilayer ceramic modulescitations
- 2021Ni-Cu-Zn ferrites with high Curie temperature for multilayer inductors with increased operating temperaturescitations
- 2021Cofiring of LTCC multilayer assemblies with integrated NTC thermistor temperature sensor layerscitations
- 2018Functionalized thick film impedance sensors for use in in vitro cell culturecitations
- 2018Magnetron sputtered AlN layers on LTCC multilayer and silicon substratescitations
- 2015Microstructure and electric properties of CaCu3Ti4O12 multilayer capacitorscitations
- 2014Thin-film capable ceramics for humidity and temperature sensing applications
Places of action
article
Magnetron sputtered AlN layers on LTCC multilayer and silicon substrates
Abstract
This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilayer ceramic substrates. The variation of sputter parameters in a wide range following a fractional factorial experimental design generates diverse crystallographic properties of the layers. Crystal growth, composition, and stress are distinguished because of substrate morphology and thermal conditions. The best c-axis orientation of aluminum nitride emerges on ceramic substrates at a heater temperature of 150 °C and sputter power of 400 W. Layers deposited on ceramic show stronger c-axis texture than those deposited on silicon due to higher surface temperature. The nucleation differs significantly dependent on the substrate. It is demonstrated that a ceramic substrate material with an adapted coefficient of thermal expansion to aluminum nitride allows reducing the layer stress considerably, independent on process temperature. Layers sputtered on silicon partly peeled off, while they adhere well on ceramic without crack formation. Direct deposition on ceramic enables thus the development of optimized layers, avoiding restrictions by stress compensating needs affecting functional properties.