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Ferrari, A. |
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Schimpf, Christian |
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Dunser, M. |
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Thomas, Eric |
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Gecse, Zoltan |
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Tsrunchev, Peter |
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Della Ricca, Giuseppe |
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Cios, Grzegorz |
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Hohlmann, Marcus |
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Dudarev, A. |
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Mascagna, V. |
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Santimaria, Marco |
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Poudyal, Nabin |
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Piozzi, Antonella |
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Mørtsell, Eva Anne |
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Jin, S. |
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Noel, Cédric |
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Fino, Paolo |
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Mailley, Pascal |
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Meyer, Ernst |
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Zhang, Qi |
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Pfattner, Raphael | Brussels |
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Kooi, Bart J. |
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Babuji, Adara |
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Pauporte, Thierry |
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Völker, B.
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Publications (7/7 displayed)
- 2021On the fracture behavior of Cr 2 AlC coatingscitations
- 2020Mechanical and optical degradation of flexible optical solar reflectors during simulated low earth orbit thermal cyclingcitations
- 2018In-situ observations of the fracture and adhesion of Cu/Nb multilayers on polyimide substratescitations
- 2018Ab initio guided low temperature synthesis strategy for smooth face–centred cubic FeMn thin filmscitations
- 2018Influence of annealing on microstructure and mechanical properties of a nanocrystalline CrCoNi medium-entropy alloycitations
- 2018Interfacial mutations in the Al-polyimide systemcitations
- 2005Spatial light modulators with monocrystalline silicon micromirrors made by wafer bondingcitations
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conferencepaper
Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding
Abstract
S.69-79 ; Spatial light modulators (SLMs) based on micromirrors for use in DUV lithography and adaptive optics require very high mirror planarity as well as mirror stability. The ideal mechanical properties of monocrystalline silicon make this material ideally suited for use in high precision optical MEMS devices. However, the integration of MEMS with CMOS poses certain restrictions on processing temperatures as well as on the compatibility of materials. The key to the successful fabrication of monocrystalline silicon micromirrors on CMOS is the silicon layer transfer process. Here, we discuss two carefully adapted wafer bonding processes that are CMOS compatible and that allow the transfer of a 300nm thick monocrystalline silicon thin film from a SOI donor wafer. One process is based on adhesive bonding using a patterned polymer layer, while the other process is based on direct bonding to a planarization layer of polished glass.