People | Locations | Statistics |
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Ferrari, A. |
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Schimpf, Christian |
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Dunser, M. |
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Thomas, Eric |
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Gecse, Zoltan |
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Tsrunchev, Peter |
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Della Ricca, Giuseppe |
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Cios, Grzegorz |
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Hohlmann, Marcus |
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Dudarev, A. |
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Mascagna, V. |
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Santimaria, Marco |
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Poudyal, Nabin |
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Piozzi, Antonella |
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Mørtsell, Eva Anne |
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Jin, S. |
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Noel, Cédric |
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Fino, Paolo |
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Mailley, Pascal |
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Meyer, Ernst |
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Zhang, Qi |
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Pfattner, Raphael | Brussels |
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Kooi, Bart J. |
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Babuji, Adara |
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Pauporte, Thierry |
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Oppermann, H.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2021Co-Package Technology Platform for Low-Power and Low-Cost Data Centerscitations
- 2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chipscitations
- 2009Integrated wireless neural interface based on the Utah electrode arraycitations
- 2008Lead free solder joints: reliability and metallurgical reactions
- 2007System integration of the utah electrode array using a biocompatible flip chip under bump metallization schemecitations
- 2005Gold-gold flip chip bonding processes for RF, optoelectronic, high temperature and power devices
- 2005Fabrication of Multichip-Modules for Pixel Detectors
- 2004Investigation of Cu stud bumping for single chip flip-chip assembly
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