People | Locations | Statistics |
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Ferrari, A. |
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Schimpf, Christian |
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Dunser, M. |
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Thomas, Eric |
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Gecse, Zoltan |
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Tsrunchev, Peter |
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Della Ricca, Giuseppe |
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Cios, Grzegorz |
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Hohlmann, Marcus |
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Dudarev, A. |
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Mascagna, V. |
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Santimaria, Marco |
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Poudyal, Nabin |
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Piozzi, Antonella |
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Mørtsell, Eva Anne |
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Jin, S. |
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Noel, Cédric |
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Fino, Paolo |
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Mailley, Pascal |
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Meyer, Ernst |
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Zhang, Qi |
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Pfattner, Raphael | Brussels |
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Kooi, Bart J. |
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Babuji, Adara |
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Pauporte, Thierry |
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Koch, M.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2022Ultra-shallow dopant profiles as in-situ electrodes in scanning probe microscopy
- 2017Time-resolved photoluminescence spectroscopy of charge transfer states in blends of pentacene and perfluoropentacencitations
- 2017Measuring fibre orientation in sisal fibre-reinforced, injection moulded polypropylenecitations
- 2016High viscosity paste dosing for microelectronic applications
- 2013A 10MS/s 8-bit charge-redistribution ADC for hybrid pixel applications in 65m CMOS
- 2013Tetrathiafulvalene-1,3,5-triazines as (Multi)Donor-Acceptor Systems with Tunable Charge Transfer: Structural, Photophysical, and Theoretical Investigationscitations
- 2013Changes in the structural dimensionality of selenidostannates in ionic liquids: Formation, structures, stability, and photoconductivitycitations
- 2011Imine Derivatives on Au(111): Evidence for “Inverted” Thermal Isomerizationcitations
- 2009Biocompatible Lab-On-Substrate technology platformcitations
- 2008Nano-particle enhanced encapsulants for improved humidity resistancecitations
- 2008Micro to nano - scaling packaging technologies for future microsystems
- 2008Reliable Encapsulation of Microsystems for Automotive Use
- 2005Counting and integrating readout for direct conversion X-ray imaging concept, realization and first prototype measurementscitations
- 2005Duromer MID technology for system-in-package generationcitations
- 2005Film coating - large area encapsulation process for electronics packaging
- 2005High temperature potential of flip chip assemblies for automotive applicationscitations
- 2005Film coatings as an encapsulation process for polymer electronics
- 2005Chip in duromer technology for system in package realization
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