693.932 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Huesgen, Till
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2024Thermo-mechanical and electromagnetic simulations of a Half-Bridge Insulated Prepackage for Modular Power Modules
- 2024Horizontal Cracks in PCB Embedded Semiconductor Devices: A Real Problem or a Ghost Hunt?
- 2024Characterising Wide Bandgap Power Modules: Validating the M-Shunt Concept for High-Power Applications in the Kiloampere Range
- 2022Thermomechanical analysis of Si-chip fracture caused by double-sided Ag sintering for PCB embedded package
- 2021Top side isolation investigation of PCB embedded 1.2kV diescitations
- 2020Development of a novel 600V/50A power package with semiconductor chips sandwiched between PCB substrates using double-side Ag-sintering
- 2018Power Electronic Assemblies on Printed Wiring Boards Mounted by Silver Sinteringcitations
Places of action
| Organizations | Location | People |
|---|