Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Topics

Publications (25/25 displayed)

  • 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloys2citations
  • 2022Modelling the scaling-up of the nickel electroforming process6citations
  • 2022Characteristics of anode materials for nickel electroforming5citations
  • 2021Pulse electrodeposition of copper in the presence of a corrosion reaction7citations
  • 2020Effect of water on the electrodeposition of copper from a deep eutectic solvent42citations
  • 2019Investigation of water absorption profile of mineral wool insulationcitations
  • 2019Electrodeposition of Fe-Sn from the chloride-based electrolyte3citations
  • 2019Electroforming of large scale nickel structures for leading-edge energy, aerospace and marine applicationscitations
  • 2018Anodic reactions and the corrosion of copper in deep eutectic solvents22citations
  • 2018Pt-Ni Subsurface Alloy Catalysts45citations
  • 2018Electrodeposition of Cu from a water-containing deep eutectic solventcitations
  • 2018Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gap5citations
  • 2017The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solventscitations
  • 2017Pulse plating of copper from deep eutectic solvents9citations
  • 2017Electrodeposition of copper from deep eutectic solvents by using pulse currentcitations
  • 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solventcitations
  • 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solventcitations
  • 2016Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approach2citations
  • 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method3citations
  • 2015A soluble molecular variant of the semiconducting silicondiselenide37citations
  • 2015The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid1citations
  • 2015Codeposition of Cu-Sn from ethaline deep eutectic solvent29citations
  • 2014Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gap35citations
  • 2014Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES48citations
  • 2012Pulse Platingcitations

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Co-Authors (by relevance)

  • Green, Todd
  • Andreou, Eleni
  • Tambe, Christine Enowmbi
  • Su, X.
  • Valverde Armas, Priscila Estefania
  • Edet, John
  • Kautek, W.
  • Hansal, W.
  • Mann, R.
  • Zajkoska, S. Mrkonjić
  • Hariharan, Seenivasan
  • Tiwari, Ashwani K.
  • Coleman, Simon J.
  • Bucko, Mihael
  • Bajat, Jelena B.
  • Su, Xiaomeng
  • Valverde, Priscila
  • Silva-Martínez, S.
  • Serrà, Albert
  • Vallés, Elisa
  • Gómez, Elvira
  • Vilana, Joan
  • Roesky, Herbert W.
  • Linser, Rasmus
  • Chandra Mondal, Kartik
  • Dittrich, Birger
  • Koley, Debasis
  • Dechert, Sebastian
  • Dutta, Sayan
  • Vasa, Suresh Kumar
  • Maity, Bholanath
  • Pewnim, Naray
  • Ghosh, Swatilekha
  • Coleman, S.
  • Hansal, Wolfgang E. G.
  • Reichenbach, Andreas
  • Leisner, Peter
OrganizationsLocationPeople

document

The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solvents

  • Bucko, Mihael
  • Roy, Sudipta
  • Valverde Armas, Priscila Estefania
  • Bajat, Jelena B.
Abstract

During the last decade, choline chloride-based deep eutectic solvents (DESs) have been successfully used for electrodeposition of different metals (Cr, Mn, Cu, Ag, Fe, Zn) and alloys (ZnCr, Zn-Sn, Zn-Ni, Zn-Mn, Ni-Co etc.) on different substrates, producing films with characteristics that are completely different from those obtained from aqueous electrolytes. Yet, the processes which occur in the blank electrolytes during the cathodic polarization of the DESs, are still not completely understood. Besides, the role of water molecules in these cathodic processes, has not been investigated in detail. It is almost impossible to avoid the water presence during the electrodeposition of metal coatings from DESs. The water is absorbed due to the high hygroscopicity of DESs, but is also added with hydrated metal salts. This work aims to compare the cyclic voltammograms (CVs) of DESs of different compositions. The blank DESs were the mixtures of choline chloride with urea or with ethylene glycol. The CVs were recorded in electrolytes with various ratios of choline chloride, urea, ethylene glycol, and water. The increase in the concentration of a certain substance in DES results in the increase in the cathodic voltammetric peak or the cathodic current. So, it is possible to determine the species that are reduced preferentially from the mixture of the two or three substances. The measurements taken until now, have led us to assume interesting conclusions. Namely, the species which originate from urea, ethylene glycol or water, are reduced at more positive potential than choline chloride. Besides, it seems that the electrode potential where the reduction starts is the same for these three substances (urea, ethylene glycol and water), in case that they are analysed separately. However, when both urea and water (or both urea and ethylene glycol) are present in DES, their reduction does not occur at the same potential. Instead, the water (or ethylene glycol) reduction occurs at more positive potential, which is seen as the cathodic peak, while the urea reduction in this case is hindered (shifted to more negative potential).

Topics
  • impedance spectroscopy
  • electrodeposition